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RT5880 Rogers PCB RF Receiver DK2.2 4

RT5880 Rogers PCB RF Receiver DK2.2 4

Product Details Key Specifications/Special Features: Material: Rogers5880 Layer count: 4 Board thickness:0.254mm Surface technique: HASL ENIG: industrial test and control with gold connectors Board:high temperature FR4,rogers, arlon and other teflon Layers: 1 to 40 layers standard PCB

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Product Details

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you rt5880 rogers pcb rf receiver dk2.2 4 with competitive price. Just be free to buy good rt5880 rogers pcb rf receiver dk2.2 4 at reasonable price with us and get the datasheet from our suppliers who can working for you.

Key Specifications/Special Features:

  • Material: Rogers5880

  • Layer count: 4

  • Board thickness:0.254mm

  • Surface technique: HASL

  • ENIG: industrial test and control with gold connectors

  • Base materials: high temperature FR4,rogers, arlon and other teflon

  • Layers: 1 to 40 layers standard PCB, blind via and buried via board

  • Minimum hole size: 0.4mm

  • Board thickness: 0.4-3.2mm

  • Finishes: HAL, lead-free HAL, organic OSP, hard and soft gold plating tin, immersion silver, immersion tin and electro less nickel immersion gold


Detailed Product Description

Base Material:Rogers 5880

Product Name:Electronic Pcb/2K*4K Android Quad Core Motherboard/

PCB Prototype/Electronic Circuit Board

Number Of Layers:4-Layer

Copper Thickness:Inner 1/2 Oz-4oz;Outer 1oz-5oz

Board Thickness:Mechanical Drill: 8mil(0.2mm)

Surface Finishing:HASL/HASL Lead Free/immersion Gold/ENIG

Min. Line Width:0.075mm(3mil)

Min. Line Spacing:0.1mm(4mil)

Min. Hole Size:0.1mm(4mil)

Rogers High Frequency PCB:China Rogers Printed Circuit Board

Service:One Stop Turnkey Service

SMT Efficiency:BGA.QFP.SOP.QFN.PLCC.CHIP

Testing Service:X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing

Application:Industrial Control/Medical Device Consumer/Communications/

Electronics Device/Unicycle/Computer Pcb


Process Capability
ltemMass ProductionPrototype
Surface TreatmentHASL(LF)HASL(LF)
Immersion GoldImmersion Gold
Flash GoldFlash Gold
OSPOSP
Immersion TinImmersion Tin
Immersion SilverImmersion Silver
HASL&Gold FingerHASL&Gold Finger
selective nickelselective nickel
HASL(LF)smt Pad:>3umsmt Pad:>4um
Big Cu:>lumBig Cu:>l.5um
Immersion Tin0.4-0.8um0.8-1.2um
Immersion GoldNi:2-5urnNi:3-6urn
Au:0.05-0.10umAu:0.075-0.15um
Immersion Silver0.2-0.6um0.3-0.6um
OSP0.1-0.4um0.25-0.4um
Flash GoldNi:3-6urnNi:3-6urn
Au:0.01-0.05umAu:0.02-0.075um
LaminatesIsolaIsola
FR4 (HighTG etc)FR4(HighTG etc)
TaconicTaconic
Rogors,etcRogors,etc
MAX.Layers12(Layers)40(Layers)
MAX.Board Size20"X48"20"X48"
Board ThicknessO.4mm~6.0mm<O.4mm or >8.0mm
Max.Copper Thicknessinner Layer:4ozinner Layer:5oz
Outer Layer:10ozOuter Layer:10oz
Min.Track Width3mil/0.075mm3mil/0.075mm
Min.Track Space3mil/0.075mm3mil/0.075mm
M.in Hole Size8mil/0.2mm6mil/0.1mm
M.in Laser Hole Size4mil/0.1mm3mil/0.076mm
PTH Wall Thickness0.8mil/20um1.2mil/30um
PTH Dia.Tolerance±2mil/±50um±2mil/±50um
Aspect Ratio12:115:1
lmpedance Control±5%±5%


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