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Mix - press Rogers And FR4 8 Layer PCB Printed Circuit Boards , immersion gold pcb

Mix - press Rogers And FR4 8 Layer PCB Printed Circuit Boards , immersion gold pcb

Product Details Mix-press Rogers And FR4 8 Layer PCB Printed Circuit Boards , immersion gold pcb Quick detail: 8 layers HASL lead free Trace width space: 8mil/8mil For driverless car MOQ: 1pcs

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Product Details

Product Details

Mix - press Rogers And FR4 8 Layer PCB Printed Circuit Boards , immersion gold pcb

Quick detail:

8 layers

HASL lead free

Trace width space: 8mil/8mil

For driverless car

MOQ: 1pcs

 

Xinchenger Electronics(HK) Co.,Ltd was founded in 2002 and is located in Shenzhen.We are a Rogers high frequency board manufacturer focused on the high reliability high technology, and military markets.We manufacture blind and buried vias Rogers PCB board,high layer count high frequency pcb,heavy copper and controlled impedance RF boards.Our top market sectors include the medical, military,planar transformer,communications and Aerospace marketplaces.


Xinchenger Electronics(HK) Co.,Ltd is employee owned with a management staff of long tenure.We are a growing business with a very experienced and talented workforce. Our quality and delivery performance is notable with < 0.2% return rate.


Our commitment to quality, reliability and true partnership is evident from the review and analysis of our customer’s designs to the final inspection of our products.


If you are looking for a High Frequency Printed Circuit Board manufacturer that has the technical capabilities you require and truly will work with you as a partner – You Found It.


Or Goal is to always exceed your expectations in Quality, Reliability and Service and we mean it.


  

LayersMaximum Layer Count1~32tolerance
SizeMaximum shipping Panel Size 600mmx550mm+/-0.15mm
Board ThicknessMinimum Board Thickness 0.4mm (4L)0.6mm (6L)+/-0.1mm
Maximum Board Thickness 3.6mm +/-10%
Copper Thickness0.5~5 oz
Via HolesMinimum Via 0.2mmPTH +/-0.075mm 
Buried Vias YesNPTH +/-0.05mm
Blind Vias Yes
RatioMaximum Aspect Ratio10:01
TraceMinimum Line Width (Internal)0.075mmThe tolerance followed by IPC-6012
Minimum Line Spacing (Internal)0.075mm
Minimum Line Width (External)0.075mm
Minimum Line Spacing (External)0.075mm
Surface FinishSelective Soft Gold (MCM)0.025~0.1 um
Selective Hard Gold (SIMM)0.025~1.0 um
Immersion Gold (Ni/Au)0.025~0.1 um
HASLmin. 2.5 um
Lead Free HASLmin. 2.5 um
OSP (Entek CU106A)0.2~0.5 um
Immersion Tinmin. 0.625 um
Immersion Silvermin. 0.175 um
Carbon InkYes
Other FinishPeelable mask
MaterialCompositeRogers,Taconic
Isola,F4B
Glass FiberFR-4
High Tg,FR-4
Other MaterialsArlon,Teflon
Solder MaskLPI Yes
UVYes
ThermalYes
ReliabilityControlled Impedance/toleranceYes+/- 10%
Ionic ContaminantYesmax. 1.56 ug/cm2
Microsection Yes
Solderability TestYes
Hi Pot TestYes500~1000V
CertificateISO 9000Yes
ISO 14000 Yes
TS 16949Yes
ULYes




 


 








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