6 Layer RO4003 Rogers fr4 Mix Laminate High Frequency PCB Circuit Boards Special: Material: Rogers 4003C 0.203mm+FR4 Special requirements: blind hole 0.1mm BGA hole need to be filled Rogers 4003C fr4 Stack up files: Quick detail: Model:XCEBR-6 Size: 16*5cm Copper THK:35UM Color: Green Surface...
6 Layer RO4003 Rogers fr4 Mix Laminate High Frequency PCB Circuit Boards
Material: Rogers 4003C 0.203mm+FR4
Special requirements: blind hole
0.1mm BGA hole need to be filled
Rogers 4003C fr4 Stack up files:
Surface finish:Immersion gold,ENIG
6 layer 0.693mm thickness
Green solder mask,white silk screen
Line space and width:6mil
Delivery time:7 working days
Automotive,Backplanes,RF/Microwave,High End Computing
Signal Integrity,Medical,Military,Mobile Devices/Wireless Handsets
Railway,Servers,Switches/Routers,Thermal Management,Wireless Infrastructure
Rogers 4003 PCB Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
*AOI (Automated Optical Inspection)
High Frequency Rogers 6-layer PCB;
Based on a variety of parameters,HF signals are reflected on circuit board,meaning that the impedance (dynamic resistance) varies with respect towards the sending component.To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest amount of approach manage.
Vital for the impedances in high frequency printed circuit boards are principally the conductor trace geometry, the layer buildup, along with the dielectric continuous (er) on the supplies applied.
Materials used for HF circuit boards
For many applications, it is sufficient to use Rogersmaterial with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.
Max working panel area
457 x 610 mm
Min board thickness
4 layer: 0.40mm
6 layer: 0.80mm
8 layer: 1.00mm
10 layer: 1.20mm
Min trace width
Min hole diameter
Min Copper thickness in hole
PTH size tolerance
NPTH size tolerance
Hole position tolerance
Min solder mask dam
1E+12Ω (normal condition)
Max Board thickness/Hole size Rate
Thermal shock endurance
288 3 times in 10sec
Max Board twist and wrap
High Vlotage endurance
Copper foil peel off endurance
Hardness of resist ink
Place of Origin:
Minimum Order Quantity:
Please send gerber file for accurate price
Inner:vacuum packed bubble bag Outer:carton box
1, 000, 000PCS/week