Material:RO3003 Layer count: 10 layers Board thickness: 2.0mm Copper thickness: 1oz Minimum drill size: 0.1mm Minimum trace & gap: 0.1mm Surface finish:ENIG Blind drill: edge plating
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you ro3003 high speed low loss material 1.0mm suitable for radar system with competitive price. Just be free to buy good ro3003 high speed low loss material 1.0mm suitable for radar system at reasonable price with us and get the datasheet from our suppliers who can working for you.
Specifications:
Material: Rogers RO3003 High Speed Low Loss Material
rogers pcb dielectric constant
Layer count: 10 layers
Board thickness: 2.0mm
Copper thickness: 1oz
Minimum drill size: 0.1mm
Minimum trace & gap: 0.1mm
Surface finish: immersion Gold
Special technology: blind and buried via
Blind drill: edge plating
Applications: telecom radar system
Key Specifications/Special Features:
Specifications:
rogers substrate
Board materials: Rogers3003/5880/4003C/4350B
Layer count: 10L
Board thickness: 2.0mm
Min hole size: 0.1mm
Min track width/space: 0.2/0.2mm
Copper thickness: 2oz
Solder mask: blue/green
Silkscreen: white
Surface finishing: Immersion Gold
Testing procedures for PCB board:
We perform multiple quality assuring procedures before shipping out any PCB board
These include:
Visual inspection
Flying probe
Impedance control
Solder ability detection
Digital metallogenic microscope
AOI (automated optical inspection)
Shipping method and payment terms:
By DHL, UPS, FedEx, TNT using clients account
DHL, UPS, FedEx, TNT forwarder of China
We could ship the parcel by Russia special air line for Russian customer
(no tax in your there, 3-10 days to Moscow, 15-20 days to other city)
By sea or air for mass quantity according to customer's requirement
By customer's forwarder
Payment terms: by PayPal, T/T, Western Union
Parameter:
high frequency circuit design
oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size:(580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance:±0.13
13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
Website:www.fr4-pcb.com/www.xce-pcb.com