RO3003 High Speed Low Loss Material 1.0mm Suitable For Radar System

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you ro3003 high speed low loss material 1.0mm suitable for radar system with competitive price. Just be free to buy good ro3003 high speed low loss material 1.0mm suitable for radar system at reasonable price with us and get the datasheet from our suppliers who can working for you.

Specifications:

Material: Rogers RO3003 High Speed Low Loss Material

rogers pcb dielectric constant

Layer count: 10 layers

Board thickness: 2.0mm

Copper thickness: 1oz

Minimum drill size: 0.1mm

Minimum trace & gap: 0.1mm

Surface finish: immersion Gold

Special technology: blind and buried via

Blind drill: edge plating 

Applications: telecom radar system

Key Specifications/Special Features:

Specifications:

rogers substrate

Board materials: Rogers3003/5880/4003C/4350B

Layer count: 10L

Board thickness: 2.0mm

Min hole size: 0.1mm

Min track width/space: 0.2/0.2mm

Copper thickness: 2oz

Solder mask: blue/green

Silkscreen: white

Surface finishing: Immersion Gold

Testing procedures for PCB board:

We perform multiple quality assuring procedures before shipping out any PCB board

These include:

Visual inspection

Flying probe

Impedance control

Solder ability detection

Digital metallogenic microscope

AOI (automated optical inspection)

Shipping method and payment terms:

By DHL, UPS, FedEx, TNT using clients account

DHL, UPS, FedEx, TNT forwarder of China

We could ship the parcel by Russia special air line for Russian customer 

(no tax in your there, 3-10 days to Moscow, 15-20 days to other city) 

By sea or air for mass quantity according to customer's requirement

By customer's forwarder

Payment terms: by PayPal, T/T, Western Union

Parameter:

high frequency circuit design

oItemData

1Layer:1 to 24 layers

2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

3Board thickness:0.20mm to 3.4mm

4Copper thickness:0.5 OZ to 4 OZ

5Copper thickness in hole:>25.0 um (>1mil)

6Max. Board Size:(580mm×1200mm)

7Min. Drilled Hole Size:4mil(0.1mm)

8Min. Line Width:3mil (0.075mm)

9Min. Line Spacing:3mil (0.075mm)

10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, 

                                           Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

11Solder Mask Color:Green/Yellow/Black/White/Red/Blue

12Shape tolerance:±0.13

13Hole tolerance:PTH: ±0.076 NPTH: ±0.05

14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing

15Certificate:UL,SGS,ISO 9001:2008

16Special requirements:Buried and blind vias+controlled impedance +BGA

17Profiling:Punching, Routing, V-CUT, Beveling

Karen-Sales Department

ShenZhen Xinchenger Electronics Co.,Ltd

sales3@xcepcb.com

Skype:karen-xcepcb

Website:www.fr4-pcb.com/www.xce-pcb.com