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RF Power Amplifier Rogers ENIG High Frequency

Material:Rogers Layer:8 Color:Gold Copper Thickness:2OZ Board Size:105*58.9mm Surface:ENIG

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Product Details

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you rf power amplifier rogers enig high frequency with competitive price. Just be free to buy good rf power amplifier rogers enig high frequency at reasonable price with us and get the datasheet from our suppliers who can working for you.


Xinchenger PCB is a quick turn China Rogers PCB manufacturer specializing in Rogers,Taconic,Isola,F4B PCB prototype to mass production. The independent oversea marting department was found at the very begaining of our establishment to satisfy different PCB customers' demand. We are organized to provide our global customers with quality High Frequency PCBs at a low cost. 

 

Every Rogers PCB is manufactured in compliance to standards adopted by ISO 9001. This also ensures that product manufacture is done as per the customer's environmental and regulatory requirements. We have thrived in a highly competitive integrated circuits industry primarily due to our unwavering commitment to meet the customer's specifications, quality and on-time delivery.


Detailed Product Description

Base Material:Rogers 4003

rogers pcb dielectric constant

Product Name:Electronic Pcb/2K*4K Android Quad Core Motherboard/PCB Prototype/Electronic 

Circuit Board

Number Of Layers:8-Layer

Copper Thickness:Inner 1/2 Oz-4oz;Outer 1oz-5oz

Board Thickness:Mechanical Drill: 8mil(0.2mm)

Surface Finishing:HASL/HASL Lead Free/immersion Gold/ENIG

Min. Line Width:0.075mm(3mil)

Min. Line Spacing:0.1mm(4mil)

Min. Hole Size:0.1mm(4mil)

Rogers High Frequency PCB:China Rogers Printed Circuit Board

Service:One Stop Turnkey Service

SMT Efficiency:BGA.QFP.SOP.QFN.PLCC.CHIP

Testing Service:X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing

Application:Industrial Control/Medical Device Consumer/Communications/Electronics 

Device/Unicycle/Computer Pcb



No.ItemMass ProductionPrototype
1Layer Count1-8Layers1-20Layers
2Max. Panel Size600*770mm( 23.62"*30.31")

600*770mm(23.62"*30.31") 
500*1200mm(19.69"*47.24")

3Max. Board Thickness8.5mm8.5mm
4Min. Board Thickness

2L:0.3mm

6L:0.4mm

8L:0.8mm

2L:0.2mm

6L:0.4mm

8L:0.6mm

5Min Inner Layer Clearance0.1mm(4mil)0.1mm(4mil)
6Min Line width0.1mm(4/4 mil)0.075mm(3/3 mil)
7Min Line space0.1mm(4/4 mil)0.075mm(3/3 mil)
8Min.Hole Size0.15mm(8mil)0.1mm(6mil)
9Min plated hole thickness20μm(0.8mil)20μm(0.8mil)
10

Min Blind/Buried hole size

0.2mm(8mil)0.2mm(1-8layers)(8mil)
11PTH Dia. Tolerance±0.076mm(±3mil)±0.076mm(±3mil)
12Non PTH Dia. Tolerance±0.05mm(±2mil)±0.05mm(±2mil)
13Hole Position Deviation±0.05mm(±2mil)±0.05mm(±2mil)
14Heavy Copper4OZ/140μm6OZ/175μm
15Min S/M Pitch0.1mm (4mil)0.1mm (4mil)
16Soldermask ColourGreen,black,Blue,White,Yellow,RedGreen,black,Blue,White,Yellow,Red
17Silkscreen ColourWhite,Yellow,Red,BlackWhite,Yellow,Red,Black
18OutlineRouting,V-Groove, Beveling punchRouting,V-Groove, Beveling punch
19Outline Tolerance±0.15mm ±6mil±0.15mm (±6mil)
20Peelable MaskTop,bottom,double sidedTop,bottom,double sided
21Controlled Impedance+/- 10%+/- 7%
22Insulation Resistance1×1012Ω(Normal)1×1012Ω(Normal)
23Through Hole Resistance<300Ω(Normal)<300Ω(Normal)
24Thermal Shock3×10sec@288℃3×10sec@288℃
25Warp and Twist≤0.7%≤0.7%
26Electric Strength>1.3KV/mm>1.4KV/mm
27Peel Strength1.4N/mm1.4N/mm
28Solder Mask Abrasion>6H>6H
29Flammability94V-094V-0
30Test Voltage50-330V50-330V



















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