Layer: 4 Material: Rogers Thickness: 1.6mm Copper: 1oz Mini hole: 0.2mm Mini width/space: 0.2mm/0.2mm Finish: immersion Gold
White solder mask,
Copper THK: 1OZ
High Precision Rogers 4350B PCB Single Sided / Rogers PCB Fabrication
Key Specifications/Special Features:
Mini hole: 0.2mm
Mini width/space: 0.2mm/0.2mm
Finish: immersion Gold
Specialized in two- to 32-layer PCB
ISO 9001-, ISO 14001-, ISO/TS 16949-, UL- and RoHS-certified
Partner of over 2000 small- and medium-scale customers
Two factory bases with over 15, 000 square meters
Less than 12 hours’ quick response
Widely acclaimed satisfying service beyond expectation
Above 66% PCB exported to international
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.