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High Frequency Multilayer PCB Service

High Frequency Multilayer PCB Service

High Frequency Pcb, Oem High Frequency Pcb, Electronic High Frequency Pcb manufacturer / supplier in China, offering High Frequency Multilayer PCB Service, Expert Supplier Circuit Board, PCB Assembly (OEM PCBA service), 1-20 Layer PCB Manufacturer and so on.

Product Details
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you high frequency multilayer pcb service with competitive price. Just be free to buy good high frequency multilayer pcb service at reasonable price with us and get the datasheet from our suppliers who can working for you.

Product Detail

Basic Info
  • Model NO.:OEM

  • Structure:High Frequency PCB

  • Dielectric:FR-4

  • Material:Epoxy Paper Laminate

  • Production Process:Semi-Additive Process

  • Base Material:Fr4

  • Copper Thickness:1oz

  • Board Thickness:1.6mm

  • Min. Hole Size:0.1mm

  • Min. Line Width:0.1mm

  • Surface Finishing:Immersion Gold

  • Trademark:OEM

  • Specification:RoHS

  • Origin:Shenzhen, China

Product Description
OEM/ODM/EMS Services for PCBA:
PCBA, PCB Board assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Capability - SMT
Lines 9(5 Yamaha, 4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm. (18"X14")
Min Component size 0201-54 sq. Mm. (0.084 sq. Inch), long connector, CSP, BGA, QFP
Speed 0.15 sec/chip, 0.7 sec/QFP
Capability - PTH
Lines 2
Max board width 400 mm
Type Dual wave
Pbs status Lead-free line support
Max temp 399 degree C
Spray flux add-on
Pre-heat 3

If you need to get a formal quotation, please provide the spec as below:
1. PCB files in gerber file, . Pcb or. Pcbdoc formart
Please feel free to contact Fulltronics team. We are here ready to assist you with our professional skills and cheerful services

Stencil size/range:


Minimum IC pitch:


Maximum PCB size:

1200x 500mm

Minimum PCB thickness:


Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:


BGA ball pitch:

1.00mm   (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm   (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm   (minimum), 2.54mm (maximum)

Frequency of stencil cleaning:

1 time/5 to 10 pieces


Turn Times:

Quick turn are our Specialty


One piece to low valume production quantityes

Low cost first article builds

Schedule deliveries

Assembly type:

Surface mount(SMT) assembly


Mixed(surface mount and thu-hole) technology

Single or double sided placement

Cable assembly

Components type:

Passive components:

As small as 0402 package

As small as 0201 with design review

Ball Grid Arrays(BGA):

As small as .5mm pitch



Laser cut stainless steel

Parts procurements:

Turnkey(we supply the parts)

Consigned(you supply the parts)

You supply some parts, we do the rest

Solder type:


Lead-free/ROHS compliant

Other capabilities:

Repair/rework services

Mechanical assembly

Box build/electromechanical assembly

Mould and plastic injection.

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