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Half Hole Technology Rogers PCB Circuit Boards With High Frequency Substrate

Half Hole Technology Rogers PCB Circuit Boards With High Frequency Substrate

Rogers PCB, High Frequency Circuit Board manufacturer/supplier,offering High Density Printed Circuit Board PCB, Blue Impedance Controlled PCB Circuit for Electronics Manufacturer

Product Details

                                   Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you half hole technology rogers pcb circuit boards with high frequency substrate with competitive price. Just be free to buy good half hole technology rogers pcb circuit boards with high frequency substrate at reasonable price with us and get the datasheet from our suppliers who can working for you.

Basic Info

  • Model NO.: high_density_pcb

  • Dielectric: Rogers

  • Application: RF Transmitter

  • Base Material: Rogers

  • Brand: XCE

  • Surface: ENIG

  • Trademark: XCE

  • Origin: Shenzhen, China

  • Type: Rigid Circuit Board

  • Thickness: 1.6mm

  • Layer: 2

  • Lead Time: 12 Working Days

  • Specification: UL(US&Canada). ISO. RoHs, TS, SGS

  • HS Code: 8534009000


 

Which widely be used for :
Automotive Antennas / RFID
Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability
Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital


XCE PCB technical specification
Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 

 














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