GPS Module PCB, Main Board, PCB Assembly manufacturer / supplier in China, offering High Quality PCB for Air Conditioner Universal with 1oz Copper, Impedance Controlled PCB Printed Circuit Board with UL, High Quality LED PCB Flex Circuit and so on.
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you gold plating rogers 0.2mm board thickness custom printed circuit board manufacturing process with competitive price. Just be free to buy good gold plating rogers 0.2mm board thickness custom printed circuit board manufacturing process at reasonable price with us and get the datasheet from our suppliers who can working for you.
XCE PCB technical specification
Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness ＞0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance＞1012Ωnormal
Through-hole resistance＜300Ωnormal
Electric strength＞1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity＞6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
Specification:
| Brand: XCE |
| Number of layer: 2 |
| Surface finish: Gold plating |
| Board size: 10*20cm |
| Board thickness: 0.2mm |
| Cu thickness: 1OZ |
| Base material: Rogers4350B |
| Origin: Shenzhen |
| Files | Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant),High frequency Material (Rogers, Teflon, Taconic) |
| Layer No. | 1 - 30 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.5OZ - 4OZ |
| Impedance Control | ±10% |
| Warpage | 0.075%-1.5% |
| Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
| Min Trace Width (a) | 0.005"(0.125mm) |
| Min Space Width (b) | 0.005"(0.125mm) |
| Min Annular Ring | 0.005"(0.125mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Regesiter torlerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Soldermask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Aspect Ratio | 6:01 |
| Hole Registration | 0.004"(0.1mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001:2000 TS16949 SGS UL |
| Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
