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60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure

60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure

60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure Key Specifications/Special Features: PCB features: Layer: 2 Material: Rogers Thickness: 1.524mm Copper: 1oz Mini hole: 0.2mm Mini width/space: 0.2mm/0.2mm Finish: immersion Gold Specifiction: layer:4 board...

Product Details

60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure


Key Specifications/Special Features:

PCB features:

Layer: 2

Material: Rogers

Thickness: 1.524mm

Copper: 1oz

Mini hole: 0.2mm

Mini width/space: 0.2mm/0.2mm

Finish: immersion Gold


Specifiction:

layer:4

board thickness:1.524mm

Copper thickness:1oz

min Hole size:0.2mm

min line width and distance:10/10mil

Surface treatment: imersion gold

Application: 60GHz Development System

Product Description

L1-L2 Blind holes;

L2-L3 Bury holes;

L1-L4 Through holes;

Copper based with Rogers 4003 T1.3mm.

Copper thickness 0.70mm;

Milling thickness 1.2mm.


6360747032923284789353579.jpg


Specification

PCB Type:Rogers PCB
Layer :2 layer
Min .Line Width/Space:3mil/3mil
Min. Via Diameter:0.3mm
Finish Thickness:0.2mm
Surface Finish:ENIG
Size:65*165MM
Material:Rogers
Color:White
Application:aviation


60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure

Available substrates:

RO4350B RO4003C TLX-8 (TACONIC) F4B Woven Glass-Reinforced PTFE

4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm)

10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm)

13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm)

20mil (0.508mm) 32mil(0.813mm)

30mil(0.762mm) 60mil(1.524mm)

60mil(1.524mm)


Specification:

High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.








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