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6 Layer rogers PCB with Immersion Gold

6 Layer rogers PCB with Immersion Gold

Product Details Specification 6 layer Green solder mask, Model:XCEH Copper THK: 1OZ Location: Shenzhen High Precision Rogers 4350B PCB Single Sided / Rogers PCB Fabrication The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus...

Product Details

                               

Product Details

Specification

6 layer

Green solder mask, 

Model:XCEH

Copper THK: 1OZ

Location: Shenzhen

High Precision Rogers 4350B PCB Single Sided / Rogers PCB Fabrication

 

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.





Which widely be used for :

Automotive Antennas / RFID

Back-up Aids

Collision Avoidance

Low-Noise Block Downconverter (LNB)

Mobile Infrastructure Antennas

Point to Point Digital Radios

Power Amplifiers

High Reliability

Airborne Antenna Systems

Broadcast Satellites

Ground Based Radar Systems

Millimeter Wave Applications

Missile Guidance Systems

High Speed Digital

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Key Specifications/Special Features:

  • Multilayer PCBs

  • Number of layers: Up to 12-layers

  • Major material: Rogers,FR4

  • Min. board thickness:

    • Double side: 0.2mm (7.8 mil)

    • 4 layer: 0.6mm (24 mil)

    • 6 layer: 0.8mm (32 mil)

    • 8 layer: 1.0mm (40 mil)

    • 10 layer: 1.2mm (48 mil)

    • 12 layer: 1.5mm (59 mil)

  • Max. board thickness: 2.4mm (95 mil)

  • Surface finishing:

    • Flash gold plating

    • Immersion gold (max. 0.5 micrometer)

    • Thick gold plating (max. 1.0 micrometer)

    • Hot-air solder leveling

    • Entek coating (OSP)

  • Solder mask: LPI (wet film), thermal cured type

  • Other print:

    • Carbon print, peelable solder mask

    • Solder mask plugged hole

  • Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140micrometer)

  • Min. hole size: 0.3mm (12 mil)

  • Hold size tolerance (NPTH): +/- 0.076mm (3 mil)

  • Min. line width and spacing: 0.1mm (4 mil)

  • Min. solder mask clearance: 0.076mm (3 mil)

  • Min. annular ring: 0.076mm (3 mil)

  • Profile and v-cut:

    • V-cut, jump v-cut, CNC v-cut

    • CNC-routing, stamping and beveling

  • Special process: Blind/buried via hole


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