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6-layer Immersion Tin Multilayer PCBs with 3 Sets Etching Machines and 10 Sets Electrical Testers

6-layer Immersion Tin Multilayer PCBs with 3 Sets Etching Machines and 10 Sets Electrical Testers

6-layer Immersion Tin Multilayer PCBs with 3 Sets Etching Machines and 10 Sets Electrical Testers

Product Details
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you 6-layer immersion tin multilayer pcbs with 3 sets etching machines and 10 sets electrical testers with competitive price. Just be free to buy good 6-layer immersion tin multilayer pcbs with 3 sets etching machines and 10 sets electrical testers at reasonable price with us and get the datasheet from our suppliers who can working for you.

Product Details

   

Key Specifications/Special Features:

  • 2 sets programming machines

  • CAD CAM with film plotter

  • 2 sets electroless copper plating machines

  • 15 sets drilling machines

  • 3 sets automatic tin/gold plating machines

  • 3 sets etching machines

  • 2 sets hot air leveling machines

  • 10 sets electrical testers

  • Computer controlled atomic absorption machine

  • Dry/wet film photoimageable solder masking

  • Silk-screening machines

  • X-ray machine

Main Export Markets:

  • Eastern Europe

  • North America

  • Mid East/Africa

  • Central/South America

  • Asia

  • Western Europe

  • Australasia


Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers

  • Microwave point to point (P2P) links

  • Automotive Radar and Sensors

  • RF Identification (RFID) Tags

  • LNB’s for Direct Broadcast Satellites

 

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.


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