PCB Board, PCB Assembly, Bonding PCB manufacturer / supplier in China, offering Manufacturing 4 Layer Bonding PCB Board for Electronic Products, 6L Enig PCB with Rogers Material and 3.2mm Final Thickness, Single Layer Lf HASL PCB Board and so on.
We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement
SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
PCB Files →DCC →Program Organizing →Optimization →Checking
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment
What's our PCBA manufacturing productivity?
SMT Workshop (8 complete automatic SMT lines: 6 million points/day )
Solder paste printer
SMT chip mounter
AOI(Automatic Optical Inspection)
DIP Workshop (2 DIP production lines: 0.4 million points /day )
Wave Soldering oven
Manual insertion flow line
Manual Soldering (2 Hand soldering lines: 0.10 million points/day)
Manual soldering lines
Electronic soldering iron in soldering operation