PCB Board, PCB Assembly, PCB Design manufacturer / supplier in China, offering 6 Layer Heavy Tin PWB PCB for Electrical Products, USB Hub Multilayer Electronics PCB Manufacturer with Good Quality, Customized Fr-4 1.6mm 1oz PCB Board and so on.
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Model NO.: XCE_PCB736
Application: Consumer Electronics
Processing Technology: Electrolytic Foil
Base Material: Copper
Copper Thickness: 0.5oz-12 Oz
Min. Line Width/Spacing: 0.075mm
Surface Finishing: OSP, HASL, Lf-HASL, Enig(Chem. Gold), Immersion Ti
Certificate: UL, ISO9001, ISO14001, RoHS, SGS
Structure: Multilayer Rigid PCB
Material: Epoxide Woven Glass Fabric Laminate
Flame Retardant Properties: V0
Production Process: Additive Process
Insulation Materials: Epoxy Resin
Base Materials: Fr-4, Fr-1, Cem-1, Cem-3, Aluminum
Min. Hole Size: 0.15mm (Mechanical Drilling) 0.1mm (Laser Drilling
Plugging Vias Capability: 0.2-0.8mm
Solder Mask Color: Green/Black/White/Red/Blue/Yellow
Specification: CE, ROHS
SMT and DIP are integrated on the PCB board parts of the way,
the main difference is that SMT does not need to drill on the PCB,
the DIP pin in the need to insert the hole has been drilling holes.
SMT (Surface Mounted Technology)
Surface mount technology,
the main use of the placement machine is to install some small parts to the PCB board,
the production process: PCB board positioning, printing paste, placement machine placement,
back to the furnace and made of inspection. With the development of science and technology,
SMT can also be a number of large parts of the placement,
such as the motherboard can be mounted on some larger size parts.
SMT integration when the positioning and the size of parts is very sensitive,
in addition to the quality of solder paste and printing quality also play a key role.
DIP is the "plug-in", that is, in the PCB version of the insert parts,
At present the industry has manual plug-in and robot plug-in two ways to achieve,
the main production process: paste glue (to prevent tin plating should not have places),
plug-in, test, wave soldering, brush version (removed in the furnace The process of leaving the stain) and made the test.
SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard
Following are some types introduction for Rigid PCB and High Frequency PCB:
FR4 PCB(2layer,4 layer,multilayer)
F4B high frequency pcb board
Arlon high frequency pcb board
ISOLA high frequency pcb board
Sincerely look forward to cooperating with you.
If you have a product quotation, please do not hesitate to contact us, thank you!
ShenZhen Xinchenger Electronics Co.,Ltd