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FR4 High TG pcb board assembly OEM Prototype

PCB Board, PCB Assembly, PCB Design manufacturer / supplier in China, offering 6 Layer Heavy Tin PWB PCB for Electrical Products, USB Hub Multilayer Electronics PCB Manufacturer with Good Quality, Customized Fr-4 1.6mm 1oz PCB Board and so on.

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Product Details

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you fr4 high tg pcb board assembly oem prototype with competitive price. Just be free to buy good fr4 high tg pcb board assembly oem prototype at reasonable price with us and get the datasheet from our suppliers who can working for you.

Basic Info

  • Model NO.: XCE_PCB736

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Processing Technology: Electrolytic Foil

  • Base Material: Copper

  • Brand: XCE

  • Copper Thickness: 0.5oz-12 Oz

  • Min. Line Width/Spacing: 0.075mm

  • Surface Finishing: OSP, HASL, Lf-HASL, Enig(Chem. Gold), Immersion Ti

  • Certificate: UL, ISO9001, ISO14001, RoHS, SGS

  • Trademark: XCE

  • Origin: Shenzhen

  • Structure: Multilayer Rigid PCB

  • Material: Epoxide Woven Glass Fabric Laminate

  • Flame Retardant Properties: V0

  • Production Process: Additive Process

  • Insulation Materials: Epoxy Resin

  • Base Materials: Fr-4, Fr-1, Cem-1, Cem-3, Aluminum

  • Min. Hole Size: 0.15mm (Mechanical Drilling) 0.1mm (Laser Drilling

  • Plugging Vias Capability: 0.2-0.8mm

  • Solder Mask Color: Green/Black/White/Red/Blue/Yellow

  • OEM/ODM: Yes

  • Specification: CE, ROHS

SMT and DIP are integrated on the PCB board parts of the way, 

the main difference is that SMT does not need to drill on the PCB, 

the DIP pin in the need to insert the hole has been drilling holes.

SMT (Surface Mounted Technology)

Surface mount technology, 

the main use of the placement machine is to install some small parts to the PCB board, 

the production process: PCB board positioning, printing paste, placement machine placement, 

back to the furnace and made of inspection. With the development of science and technology, 

SMT can also be a number of large parts of the placement,

 such as the motherboard can be mounted on some larger size parts.

SMT integration when the positioning and the size of parts is very sensitive, 

in addition to the quality of solder paste and printing quality also play a key role.


DIP is the "plug-in", that is, in the PCB version of the insert parts, 

At present the industry has manual plug-in and robot plug-in two ways to achieve, 

the main production process: paste glue (to prevent tin plating should not have places), 

plug-in, test, wave soldering, brush version (removed in the furnace The process of leaving the stain) and made the test.


Typical Applications

SMD package, Chip-on-board and Flip Chip assembly technique

0201 chip, Micro BGA, u-BGA, QFN and LGA assembly

AI and Thru-hole assembly

RoHS, REACH compliance and Lead-Free solder technology

Chip Programming

Conformal Coating

ICT test and AOI inspection

ESD Protection Control Procedure

IPC-A-610E Class II and Class III Workmanship Standard


Following are some types introduction for Rigid PCB and High Frequency PCB:

FR4 PCB(2layer,4 layer,multilayer)


F4B high frequency pcb board


Arlon high frequency pcb board

ISOLA high frequency pcb board

Sincerely look forward to cooperating with you.

If you have a product quotation, please do not hesitate to contact us, thank you!



Karen-Sales Department

ShenZhen Xinchenger Electronics Co.,Ltd




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