Product Details Key Specifications/Special Features: Material: FR4 Layer: 4 Board thickness: 1.6mm Surface technique: immersion gold(ENIG) E-TEST Base materials: high temperature FR4, CEM-3, aluminum based, polyamide, rogers, arlon and other Teflon Layers: 1 to 40 layers standard PCB, blind via...
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Board thickness: 1.6mm
Surface technique: immersion gold(ENIG)
Base materials: high temperature FR4, CEM-3, aluminum based, polyamide, rogers, arlon and other Teflon
Layers: 1 to 40 layers standard PCB, blind via and buried via board
Minimum hole size: 0.4mm
Board thickness: 0.4-3.2mm
Finishes: HAL, lead-free HAL, organic OSP, hard and soft gold plating tin, immersion silver, immersion tin
Meet the various requirements of customers,
we can purchase various brand IC, Resistor, Capicitor, Inductor etc.
3. PCB Assembly
SMT and Through-Hole Assembly Fine Pitch Placement
RoHS Compliance Assembly QFN and BGA Assembly
Turn-Key PCB Assembly BGA X-Ray Inspection
Prototype PCB Assembly AOI Testing
Low Volume PCB Assembly Functional Testing
SMT and DIP are integrated on the PCB board parts of the way,
the main difference is that SMT does not need to drill on the PCB,
the DIP pin in the need to insert the hole has been drilling holes.
SMT (Surface Mounted Technology)
Surface mount technology,
the main use of the placement machine is to install some small parts to the PCB board,
the production process: PCB board positioning, printing paste, placement machine placement,
back to the furnace and made of inspection. With the development of science and technology,
SMT can also be a number of large parts of the placement,
such as the motherboard can be mounted on some larger size parts.
SMT integration when the positioning and the size of parts is very sensitive,
in addition to the quality of solder paste and printing quality also play a key role.
DIP is the "plug-in", that is, in the PCB version of the insert parts,
At present the industry has manual plug-in and robot plug-in two ways to achieve,
the main production process: paste glue (to prevent tin plating should not have places),
plug-in, test, wave soldering, brush version (removed in the furnace
The process of leaving the stain) and made the test.
Country of Origin
Small Orders Accepted
Payment Method:Telegraphic Transfer (TT,T/T)
Minimum Order:1 Piece
FOB Range: US$ 1 - US$ 5 per unit (Pieces)
Lead Time: 8-10 days
ShenZhen Xinchenger Electronics Co.,Ltd