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DIP PCB Assembly, Automatic Components Pin Shaping and Trimming, 5 Million Points Daily Yield

DIP PCB Assembly, Automatic Components Pin Shaping and Trimming, 5 Million Points Daily Yield

Product Details Key Specifications/Special Features: PCBA contract manufacturing service: DIP assembly, solder penetration on both sides for thick PCB with heavy copper; SMT placement for SOP, QFP, CSP, and BGA packages, 0201 components size In-circuit testing and functional testing ; Flip...

Product Details

                                  

Product Details

Key Specifications/Special Features:

PCBA contract manufacturing service:

  • DIP assembly, solder penetration on both sides for thick PCB with heavy copper;

  • SMT placement for SOP, QFP, CSP, and BGA packages, 0201 components size 

  • In-circuit testing and functional testing ;

  • Flip chip/wire bonding;

  • Complete products assembly;

  • Engineering test, logistics and after-sale services;

  • All trademarks shown here are for demonstration purposes only;

  • They are the property of their respective owners, and we are not authorized to sell items bearing such trademarks;

  • Experienced in one station assembly for boards used in automotive control, industrial control, telecommunication, commercial applications.


PCB fabrication capacity: 

  • Layer stackup: 2 to 32 layers;

  • Material: FR4 with Tg120-Tg200, Rogers RO4350, RO3003, Nelco N4000-13, N4000-13EP, N4000-13EPSI, metal based boards;

  • Copper weight: 1 to 6oz cooper thickness, 

  • Finished board thickness: 0.5mm to 5mm;

  • Minimum hole size: 0.15mm (diameter);

  • Minimum trace width:  0.12mm;

  • Minimum trace distance:  0.13mm;

  • Buried hole, laser hole, blind hole;

  • Surface finish: OSP, HASL, immersion Sn/Au/Ag;

  • UL and RoHS marks.


Equipment:

  • High speed SMT machines in 4 lines (Yamaha, YG200, YV100Xg); 

  • Solder paste screen printer; 

  • Hot air N2 re-flow oven Re-flow soldering machines; 

  • Thermal profiler Solder paste thickness analyzer;

  • X-ray radiography for BGA soldering quality inspection; 

  • Automatic Optical Inspection machine.


PCB Assembly Manufacturing Procedures: 

vProgram Management 

PCB Files →DCC →Program Organizing →Optimization →Checking 

vSMT Management 

PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping 

vPCBA Management 

THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment





Primary Competitive Advantages:

  • Country of Origin

  • Distributorships Offered

  • Electronic Link

  • Experienced Staff

  • Form A

  • Green Product

  • Guarantee/Warranty

  • International Approvals

  • Military Specifications

  • Packaging

  • Price

  • Product Features

  • Product Performance

  • Prompt Delivery

  • Quality Approvals

  • Reputation

  • Service

  • Small Orders Accepted


Main Export Markets:

  • Asia

  • Australasia

  • Central/South America

  • Eastern Europe

  • Mid East/Africa

  • North America

  • Western Europe





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