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6 Layer Side PCB Assembly

6 Layer Side PCB Assembly

Rigid Pcb/Pcba, 6 Layer Side PCB manufacturer / supplier in China, offering 6 Layer Side PCB, Lead Free HASL Single Layer PCB Double PCB, Lead Free HASL Single Layer PCB and so on.

Product Details

      

Product Detail

Product Description

LEAD Free HASL multi -layer Rigid PCB/PCBA
1. SMT service;
2. Design service, Gerber drawings;
3. Good quality and fast delivery with lower price than double side PCB.
4. Specifications of LEAD Free HASL multi-layer Rigid PCB/PCBA
1) Base material: FR-4
2) Max Board size: 600*600mm
3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm
4) Copper thickness: 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 7oz, 11oz
5) Special tech: BGA, PTH, Blind and buried vias
6) Profile: V-scoring, V-cutting, punching, etching, milling, routing
7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating)
8) With best price to USA, South American, India, South Africa and Europe
9) Main market: USA, Egypt, Europe, South American, MID-east
10) Compliant: UL, RoHS, ISO9001-2000
11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II
12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical equipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night
13) Small quantity and prototypes acceptable
14) Lead time: 5-7days for prototypes, 9-13days for mass production
15) Available Service: OEM, 24hrs service for fast prototype


PCB Assembly Details: 

Standard Component Sourcing Service 

Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware 

Technical Requirement for PCB Assembly: 

v Professional Surface-mounting and Through-hole soldering Technology 

v Various sizes like 1206,0805,0603,0402,0201 components SMT technology 

v ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 

v PCB Assembly With UL,CE,FCC,Rohs Approval 

v Nitrogen gas reflow soldering technology for SMT. 

v High Standard SMT&Solder Assembly Line 

v High density interconnected board placement technology capacity. 


PCB Assembly Manufacturing Procedures: 

vProgram Management 

PCB Files →DCC →Program Organizing →Optimization →Checking 

vSMT Management 

PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping 

vPCBA Management 

THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment


What's our PCBA manufacturing productivity?                                   

SMT Workshop (8 complete automatic SMT lines: 6 million points/day )

Automatic loader

Solder paste printer

SMT chip mounter

Reflow oven

AOI(Automatic Optical Inspection)

BGA rework


Parameter:

 

oItemData

1Layer:1 to 24 layers

2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

3Board thickness:0.20mm to 3.4mm

4Copper thickness:0.5 OZ to 4 OZ

5Copper thickness in hole:>25.0 um (>1mil)

6Max. Board Size: (580mm×1200mm)

7Min. Drilled Hole Size:4mil(0.1mm)

8Min. Line Width:3mil (0.075mm)

9Min. Line Spacing:3mil (0.075mm)

10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

11Solder Mask Color:Green/Yellow/Black/White/Red/Blue

12Shape tolerance: ±0.13

13Hole tolerance: PTH: ±0.076 NPTH: ±0.05

14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing

15Certificate:UL,SGS,ISO 9001:2008

16Special requirements:Buried and blind vias+controlled impedance +BGA

17Profiling:Punching, Routing, V-CUT, Beveling

 






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