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6-layer PCB and PCBA aseembly manufacturing min hole size0.2mm

6-layer PCB and PCBA aseembly manufacturing min hole size0.2mm

Product Details Key Specifications/Special Features: Layers: 6 Material: FR4 laminate, compliant with RoHS Directive PCB thickness: 1.6mm, +/-10% Final copper: 1/1/1/1/1/1oz Min hole: 0.2mm Min line width/space: 4/4mil Min hole copper: 20um Solder mask: Green Legend: White Surface: Immersion...

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Product Details

              

Product Details

Key Specifications/Special Features:

  • Layers: 6

  • Material: FR4 laminate, compliant with RoHS Directive

  • PCB thickness: 1.6mm, +/-10%

  • Final copper: 1/1/1/1/1/1oz

  • Min hole: 0.2mm

  • Min line width/space: 4/4mil

  • Min hole copper: 20um

  • Solder mask: Green

  • Legend: White

  • Surface: Immersion gold/Chemical gold

  • Outline: Rout and score/V-cut

  • E-test: 100%

  • Resistance test: 80-140R

  • Inspection standard: IPC-A-600H/IPC-6012B, Class 2/3

  • Outgoing reports: Final inspection, E-test, solderability test, microsection and more

  • Certificates: UL, SGS, RoHS, ISO 14001:2004, ISO/TS16949:2009

  • PCB quality assurance:

    • 100% electrical test (flying test or e-test)

    • IPC-6012A qualification and performance specification

    • IPC-A-600G acceptability of boards

    • Perfag 2E, 3C

    • cUL certified standards

    • Compliant with RoHS Directive

    • UL796 standard for safety printed wiring board

    • SGS audited supplier certificate





PCB Assembly Details: 

Standard Component Sourcing Service 

Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware 

Technical Requirement for PCB Assembly: 

v Professional Surface-mounting and Through-hole soldering Technology 

v Various sizes like 1206,0805,0603,0402,0201 components SMT technology 

v ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 

v PCB Assembly With UL,CE,FCC,Rohs Approval 

v Nitrogen gas reflow soldering technology for SMT. 

v High Standard SMT&Solder Assembly Line 

v High density interconnected board placement technology capacity. 


PCB Assembly Manufacturing Procedures: 

vProgram Management 

PCB Files →DCC →Program Organizing →Optimization →Checking 

vSMT Management 

PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping 

vPCBA Management 

THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment


What's our PCBA manufacturing productivity?                                   

SMT Workshop (8 complete automatic SMT lines: 6 million points/day )

Automatic loader

Solder paste printer

SMT chip mounter

Reflow oven

AOI(Automatic Optical Inspection)

BGA rework


DIP Workshop (2 DIP production lines: 0.4 million points /day )

Wave Soldering oven

Manual insertion flow line

Manual Soldering (2 Hand soldering lines: 0.10 million points/day)

Manual soldering lines

Electronic soldering iron in soldering operation


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We have in-house workshop for one stop shop service 

OEM (We manufacture according to your design - BOM, Gerber file and testing procedures, 

while providing you best recommendations for easy manufacturing and cost saving):

1. Component sourcing and procurement

2. PCB Manufacturing

3. Component Assembly (PCBA - SMT & Through Hole parts)

4. Chip-on-board (COB)

Surface-mount technology (SMT) 

Ball-grid array (BGA) 

Through-hole

5. Plastic Enclosure (Mould) Manufacturing

6. Metal Enclosure (Tool) Manufacturing

7. Cable & Wire harness Assembly

8. Final Assembly

9. QC Testing

10.Packaging


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