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Rogers 3006 Stack Up FR4 4 Multi Layered Pcb
Jan 04, 2018

Detailed Product Description




Min Line Space:5mil

Min Line Width:5mil

Copper Thickness:2OZ

Board Size:8*6cm



Description :

RO3000 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.

RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.

Typical Applications

Cellular Base Station Antennas and Power Amplifiers

Microwave point to point (P2P) links

Automotive Radar and Sensors

RF Identification (RFID) Tags

LNB’s for Direct Broadcast Satellites


Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.



High Power Amplifier, TMA, TMB, LNA: for GSM, UMTS, 3G, PCS, PCN, WCDMA, TD-SCDMA, EDGE, CDMA2000


Phase Shifter


Filters and Coupler

Passive Components



Exceptional Interlaminar Bond

Low Moisture Absorption

Enhanced Dimensional Stability

Low Z-Axis Expansion

Stable Dk Over Frequency

Circuit Miniturization

Increased Flexural Strength

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