Detailed Product Description
Min Line Space:5mil
Min Line Width:5mil
RO3000 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.
RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.
Cellular Base Station Antennas and Power Amplifiers
Microwave point to point (P2P) links
Automotive Radar and Sensors
RF Identification (RFID) Tags
LNB’s for Direct Broadcast Satellites
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
High Power Amplifier, TMA, TMB, LNA: for GSM, UMTS, 3G, PCS, PCN, WCDMA, TD-SCDMA, EDGE, CDMA2000
Filters and Coupler
Exceptional Interlaminar Bond
Low Moisture Absorption
Enhanced Dimensional Stability
Low Z-Axis Expansion
Stable Dk Over Frequency
Increased Flexural Strength