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Email:sales3@xcepcb.com
Printed Circuit Baord with V-Cut/High Quality PCB Manufacture
Oct 25, 2017

Basic Info

  • Model NO.: XCE-PCB 217

  • Dielectric: FR4

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Organic Resin

  • Solder Mask: Green Blue Red White Biack etc

  • Board Thickness: 1.6mm

  • Layer: 1 to 16

  • Min Hole Size: 0.2mm

  • Min Line Spacing: 0.1mm

  • Trademark: XCE-PCBA

  • Origin: China

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Mechanical Rigid: Rigid

  • Base Material: Fr4

  • Model: PCB

  • Test: Aol

  • Copper Thickness: 1oz

  • Color: Green, White, Black, Ect

  • Min Line Width: 0.1mm

  • Surface Finish: HASL, Immersion Gold, OSP

  • Specification: ISO9001, UL, SGS

  • HS Code: 85340090



Quick Details


Place of Origin:

Guangdong, China (Mainland)

Brand Name:

XCE

Model Number:
XCE-PCB 217

Number of Layers:

1-16 layers

Base Material:

FR-4

Copper Thickness:
1~5OZ

Board Thickness:

0.4--3.2mm

Min. Hole Size:

0.2mm

Min. Line Width:

0.1mm

Min. Line Spacing:

0.1mm

Surface Finishing:

immersion gold

Color:

Green,blue,black,red,yellow,white, Matt Color

Surface Finishing::

HASL,Immersion Gold/Silver, OSP

Other treatment:

Carbon treated, peelable mask,Gold finger

PTH Tolerance::

+/- 0.075 mm

NPTH Tolerance::

+/-0.05 mm

Class Standard::

IPC-6012 Class -II

Size Tolerance::

+/-0.12 mm

Origin::

China

Flammability::

UL 94V-0

Impedance control:

Yes




 

Technology capability 

 Items Single/Double-sided Board/Multilayer Board/FPC(1-24Layer)
 Base Materials  FR-4,Rogers,Taconic,Isola,F4B
 Finish copper thickness  Outer 6 OZ,Inner 4 OZ
 Surface finish  ENIG, ImAg, ImSn, OSP, HASL,Plating gold
 Finished Board Size Max Double-sided Board 640mm χ 1100mm
 Max Multilayer Board 640mm χ 1100mm
 Finished Board Hole Size (PTH Hole) Min Finished Board Hole Size 0.15mm
 Conductor Width and Spacing Min Conductor Width 0.01mm
 Min Conductor Spacing 0.01mm
 Thickness of Plating and Coating Layer PTH Wall Copper Thickness >0.02mm
 Tin Solder Thickness ( Hot  Air Leveling ) >0.02mm
 Nickl/Gold Thickness For customer special need
 Nickl Plating Layer >2um
 Gold Plating Layer >0.3um
 Bare Board Test Single Side Test Max Test Point 20480
 Max Board Test Size 400mm χ 300mm
 Double Side Test     Max Test Point 40960(General Use)
 4096(Special Use)
 Max Board Test Size 406mm χ 325mm
 320mm χ 400mm
 Min Test pitch of SMT 0.5mm
 Test Voltage 10-250V
 Mechanical Process             Chamfer 20°, 30°, 45°, 60°
 Angle Tolerance ± 5°
 Deepness Tolerance ± 0.20mm
 V-Cut Angle 20°, 30°, 45°
 Board Thickness 0.1-3.2mm
 Residues Thickness ± 0.025mm
 Cell Paraposition Precision ± 0.025mm
 Tolerance of Out-shape Process ± 0.1mm
 Board Warp Max Value 0.7%
 Optical Plotting Max Plotting Area 66mm χ 558.8mm
 Precision ± 0.01mm
 Repetitive Precision  ± 0.005mm

 


 

 
 

 

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