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Name: Power Module PCB (8 Layers)
Oct 01, 2017


Product Detail

Basic Info

  • Type:Rigid Circuit Board

  • Dielectric:FR-4

  • Material:Fiberglass Epoxy

  • Flame Retardant Properties:V0

  • Mechanical Rigid:Rigid

  • Processing Technology:Electrolytic Foil

  • Base Material:FR4

  • Insulation Materials:Organic Resin

  • Model:PCB


Product Description

Name: Power Module PCB (8 Layers)
Product Description: 
Material: FR-4
Layer Coverage: 8 Layers
Thickness: 1.6 mm
Surface Technique: Immersion Gold
Specialty: Copper Weight 175 um
                  Blind-via/Buried-via
                  Larger Current



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