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Laminate Rogers 4350b 2 Layer PCB Substrate High Frequency Printed PCB Board
Oct 17, 2017


Product Detail

Basic Info

  • Model NO.:XCE

  • Dielectric:Rogers

  • Trademark:XCE

  • Transport Package:Inner: Vacuum-Packed Bubble Bag Outer: Carton Box

  • Specification:80*90mm

  • Origin:China

  • HS Code:8534009000


Product Description

Detailed Product Description

Base Material:Rogers 4350B PcbProduct Name:Rogers 4350B Laminate
Number Of Layers:2-LayerCopper Thickness:1oz
Board Thickness:Mechanical Drill: 8mil(0.2mm)Surface Finishing:HASL/HASL Lead Free/immersion Gold/ENIG
Min. Line Width:0.075mm(3mil)Min. Line Spacing:0.1mm(4mil)
Min. Hole Size:0.1mm(4mil)Rogers High Frequency PCB:China Rogers 4350B Pcb Printed Circuit Board
Service:One Stop Turnkey ServiceSMT Efficiency:QFP.SOP.QFN.PLCC.CHIP
Testing Service:X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste TestingRogers 4350 Application:Telecommunications

 
Laminate Rogers 4350B 2 layer pcb Substrate High Frequency printed pcb board
Detailed Product Description

Model:XCEOrigin:Shenzhen
Size:8*9cmLayer2 L rogers 4350 pcb
Brand:XCEColor:Green

 
Specification
Rogers 4350B laminate in stock
2 layer rogers pcb laminate 
Green solder mask, 
Model:XCE
Copper THK: 1OZ
Location: Shenzhen
 
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

 

PCB production capability
FilesGerber, Protel, Powerpcb, Autocad, Orcad, Eagle,etc.
MaterialFR-4, Hi-Tg FR-4, 
Lead free Materials (RoHS Compliant) , 
CEM-3, CEM-
1, 94V0,Aluminium, 
High frequency Material (Rogers, 
Teflon, Taconic)
Layer No.1 - 28 Layers
Board thickness0.0075"(0.2mm)-0.
125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02
'(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask 
and LF-FREE surface finishing BGA Pitch (b)
0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.2
57"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, 
Immersion gold, Gold 
plating, Gold finger,
 immersion silver, immersion
 Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001:2008  
TS16949  SGS  UL  CE
Special requirementsBuried and blind vias,
 Impedance control, 
via plug, BGA soldering 
and gold finger

 
Materials used for HF circuit boards
For many applications, it is sufficient to use Rogers material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
 
Which widely be used for :
Automotive Antennas / RFID
Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability
Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital


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