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High-Tech Enig PCB with GF and Blind/Buried Hole
Jan 04, 2018

Basic Info

  • Model NO.: XCEPCB

  • Dielectric: FR-4

  • Application: Communication

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: XCE

  • Trademark: XCE

  • Specification: RoHS

  • HS Code: 8534001000

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • Test: Flying Probe and Test Frame

  • Transport Package: Vacuum

  • Origin: Shenzhen, China



Elevator PCB Multilayer 8L Circuit Board With High Quality Production


Specification:

Origin: China

Min line space: 3mil

Min line width: 3 mil

Board size: 6*6 cm

Layer: 8

Model: XCEM

Board thickness: 1.2mm

Copper foil: 35UM

Material: FR4


Parameter:

 


Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating




 



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