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HDI Multi Layer Impedance Control Enig PCB Fast Turn
Aug 18, 2017

Basic Info

  • Structure: Double-Sided Rigid PCB

  • Layer Count: 1-30 Layers

  • Copper Thickness: 0.5-6 Oz

  • Surface Treatment: HASL

  • Silk Screen: White, Black

  • Specification: CE, ISO, UL

  • HS Code: 8466940090

  • Kind: Rigid PCB

  • Board Thickness: 0.2-5.0mm

  • Board Material: Teflon

  • Solder Mask: Green, Bule, Red, Black, Yellow, White

  • Trademark: Rigao Electronics PCB

  • Origin: China(Mainland)



PCB Base Material: Rogers
PCB Copper Thickness: 1/1
PCB Board Thickness: 0.3-5.0mm
PCB Min. Hole Size: 0.2mm
PCB Min. Line Width: 0.1mm
PCB Min. Line Spacing: 0.1mm
PCB Surface Finishing: HASL, HASL pb free, immersion gold, immersion silver, immersion tin, O. S. P (Entek), S/G plating, ENEPIG, G/F plating, carbon


NOITEMTechinical capabilities
1MaterialsTeflon, Rogers,Taconic,F4B
2layers1-22 layers
3
Min.core material
5mil(excluding copper)
4Prepreg type7628/2116/1080/3313
5Max.board size520*720mm
6Copper thicknessmin.base copper 1/3 OZ
max.finished copper6OZ
7Min.board thickness2 layer 10mil/0.25mm
4 layer 16mil /0.4mm
6 layer 24mil/0.6mm
8 layer 32mil/0.8mm
10 layer 40mil/1.0mm
8Max.board thickness236mil/6mm (finished board thickness)
9Min.line width/space3mil/3mil HOZ copper base(inner layer)
10Min.hole size8mil
11PTH wall thickness≥1mil
12Hole dia.tolerance(PTH)±3mil
13Hole dia.tolerance(NPTH)±2mil
14Countersink holeMin.depth(D)6mil;The Depth of tolerance± 6mil

Drill bit grinding angles C≥90°~180°
Hole Dia.B tolerance ±4mil
Drill bit A ≥Φ40mil
15Drilling hole positional deviation(outer layer)1st-drill ±3mil(Normal) ±2mil(min.)           
2nd-drill ±4mil
16Min.solder mask bridge3.2mil(HOZ base copper, green)
17Outline tolerance±4mil
18Twist & Bow≤0.75%
19Peelable mask thickness≥8mil 1 printing
20Insulation Resistance>10MΩ Normal
21Through hole
resistance
≤100Ω Normal
22Current breakdown10A
23Peel strength1.4N/mm
24S/M abrasion>6H
25Thermal stress288°C* 20Sec*3 times
26Test Voltage20-300V
27Min.blind/burried via8mil
28Surface finishHASL, ENIG, IMMERSION SILVER,IMMERSION TIN,OSP,HASL+GOLD FINGERS, ENIG+GOLD FINGERS,
29Impedance controlSingle ended impedance 50Ω/70Ω±10% Normal
Differential impedance 90Ω/100Ω±10% Normal
30Max.aspect ratio12:1
31
Beveling of gold fingers

 

 


 

 

 

 
Anglesθ 20° 25° 30° 35° 60°
Bevel size H:Min.12mil, Max.71mil
the tolerance of bevel height: ±4mil
Board thickness T:Min32mil,Max.79mil           


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