Home > News > Content

Product Categories

CONTACT US
Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
M.B: +86-13603055201
TEL: +86-755-26055813
FAX: +86-755-26055946
Email:sales3@xcepcb.com
Electronics Rogers PCB Assemby Board
Oct 10, 2017

Basic Info

  • Model NO.: rogers pcb assembly

  • Mode of Production: DIP&SMT

  • Base Material: Rogers

  • Customized: Customized

  • Layer: 2-Layer

  • Trademark: Shenzhen Rigao Electronics Co, . Ltd.

  • Specification: CE, RoHS

  • HS Code: 853400900

  • Metal Coating: Copper

  • Layers: Double-Layer

  • Certification: RoHS, CCC, ISO, SGS

  • Condition: New

  • Solder Mask: Green

  • Transport Package: Inner Vacuum Outer Carton

  • Origin: Shenzhen, Guangdong




1
Layer1-22 layer
2MaterialRogers,Taconic,Isola,F4B

Thick copper foil,94-V0 (HB), PI Material, Roger,
High TG:SL S1000-2,ITEQ:IT180.

3
Board thickness0.2mm-7mm
4Max.finished board side610mm*1200mm
5Min.drilled hole size0.25mm
6Min.line width0.075mm(3mil)
7Min.line spaceing0.075mm(3mil)
8Surface finish/treatment
HASL,OSP,Immersion tin,Immersion Gold

Immersion Silver/Gold Finger ,Gold Plating,
Selective OSP Immersion Gold

9
Copper thickness0.5-4.0oz
10Solder mask colorgreen/black/white/red/blue/yellow
11Inner packingVacuum packing,Plastic bag
12Outer packingStandard carton packing
13Hole tolerancePTH:±0.076,NTPH:±0.05
14Profiling PunchingRouting,V-CUT,Beveling

15

Assembly Service

Providing OEM service to all sorts of printed
circuit board assembly


 

Electronics Rogers PCB Assemby Board Capability
  ContentGeneralAdvanced
1TH components:Wave-solderingNA
2Min. Chip Placement:04020201
3QFN Lead Pitch:0.4mm0.3mm
4Min. IC Pitch:0.4mm0.3mm
5Maximum BGA Size:50mm X 50mm74mm X 74mm
BGA Ball Pitch:0.4mm0.3mm
6Max. PCB Size:350mm X 400mm410mm X 600mm
Foot Pin:SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
 



Our PCBA capability and services: SMT/THT/DIP.
1. Component Purchasing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. Packing design


PCB/PCBA Features:
Dimension: 92.5mm*36mm
Base Material: 0.1mm Cu/25um ADH/25um PI+25um ADH/35um Cu/
20um ADH/ 35um Cu/ 2525um PI+25um ADH/
25um ADH/ 0.1mm Au
Thickness: 1.6mm
Line Width/Space: 0.15mm/0.15mm
Surface Treatment: ENIG: Au: 0.03-0.09um, Ni: 2-6um
Minimum via diameter: 0.2mm
The smallest hole: 0.35mm
Outline Tolerance: +/-0.2mm.

Quick Navigation
  • About Us
  • Products
  • News
  • Exhibition
  • Contact Us
  • Capability
  • Newsletter
    Enter in your email address to receive deals and coupons.
    +86-755-26055813
    +86-755-26055946 sales3@xcepcb.com
    http://cs.ecqun.com/mobile/rand?id=3826129