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Double-Side Teflon PCB/PTFE/ High Frequency Board
Sep 09, 2017

Basic Info

  • Model NO.: S-57

  • Dielectric: Teflon

  • Flame Retardant Properties: V0

  • Processing Technology: Delay Pressure Foil

  • Insulation Materials: Epoxy Resin

  • Brand: XCE

  • Trademark: XCE

  • Specification: ROHS, SGS

  • HS Code: 85340090

  • Type: Rigid Circuit Board

  • Material: Teflon

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Model: PCB

  • Certificate: UL,RoHS,SGS

  • Transport Package: Vacuum Packing in Cartons

  • Origin: Shenzhen, China


Product Description

Name:  PCB
1. Layers: 2
2. Board Thickness: 1.6mm
3. Material: Teflon
4. Base Copper: 1/1oz
5. Min.Line Width/Spacing:0.304/0.304mm
6. Min.Hole:0.5mm
7. Legends: White
8. Solder mask:Green
9. Finishing: HASL-Lead Free
10. Impedance Control: NO
11. Profile Finish: CNC
12. Certificates: UL, ISO9001/2008, TS16949


Key Specifications/Special Features:
-Layer: 1-20
-Material: Rogers,Taconic,Isola,F4B
-PCB Thickness: 0.4-6.0mm
-Max Board Sice:580x1200mm
-Final Copper: 0.5-7oz
-Min.Hole Size : 0.1mm
-Min Line Width/Spacing: 3/3mil(0.075/0.075mm)
-Hole Size Tolerance (PTH): +/ -3mil (0.075mm)
-Hole Size Tolerance (NPTH): +/ -2mil (0.05mm)
-Hole Location Telerance: +/ -3mil (0.075mm)
-Min Hole Copper: 20μm
-Soldermasks: Green/Blue/Red/Black/Yellow/White
-Legend: White/Black/Yellow/Green
-Surface Treatment: OSP/HAL Lead-Free/Immersion Gold/immersion Tin/
-Immersion Silver/Flash gold/Hard gold
-Profile Finish: Routing/Punching/V-Cut
-E-Test: 100% E-Test With Flying Prob or E-Test Fixture
-Inspection Rtandard: IPC-A-600H/IPC-6012B, Class 2/3
-Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so   on.
-PCB Packing: Inner packing: Vacuum packing / Plastic bag
-Outer packing: Standard carton packing
-Certificates:  UL, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009
 
PCBA Capabilities:
-Professional Surface-mounting and Through-hole soldering Technology
-Various sizes like 1206,0805,0603,0402,0201,1005 components SMT technology
-ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
- PCB Assembly With UL,CE,FCC,Rohs Approval
- Nitrogen gas reflow soldering technology for SMT.
- High Standard SMT&Solder Assembly Line
-High density interconnected board placement technology capacity.
-Processing Capacity:1,000,000 components Per day

Contact us to check out great PCBs and full details, we will reply to you with prices in one working day!

 

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