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94V0 Printed PCB for USB Charger with Multilayer
Aug 16, 2017

Basic Info

  • Model NO.: XCE-16060601

  • Dielectric: FR-4

  • Application: Aerospace

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: Ucreate PCB

  • Surface Finihsing: Immersional Gold

  • Trademark: Ucreate PCB

  • Specification: IPC-Class 2

  • HS Code: 85340090

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Immersional Gold

  • Insulation Materials: Organic Resin

  • Board Thickness: 1.2~2.0mm

  • Lead Time: 6-8 Working Days

  • Transport Package: Vacuum Packing

  • Origin: Shenzhen China


 

FilesGerber, Protel, Powerpcb, Autocad, Cam350, etc
MaterialHigh frequency Material (Rogers, Teflon, Taconic)
Layer No.1 - 30 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001:2000  TS16949  SGS  UL
Special requirementsBuried and blind vias, Impedance control, via plug, BGA soldering and gold finger


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