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8L High Density PCB with Blinded and Buried Hole
Aug 29, 2017

Basic Info

  • Model NO.: XCE-D-140

  • Dielectric: FR-4

  • Application: Communication

  • Processing Technology: Electrolytic Foil

  • Base Material: Copper

  • Brand: xce

  • Trademark: XCE

  • Specification: RoHS

  • HS Code: 8534001000

  • Structure: Multilayer Rigid PCB

  • Material: Epoxide Woven Glass Fabric Laminate

  • Flame Retardant Properties: V0

  • Production Process: Subtractive Process

  • Insulation Materials: Organic Resin

  • Test: Flying Probe and Test Frame

  • Transport Package: Vacuum

  • Origin: Shenzhen, China

Product Description

Details:
Layer: 8 Layer
Finished Board thickness: 1.6mm
Board Materials: FR-4
Brand: KB
Tg value: 140
Finished copper thickness: 2 OZ
Surface treatment: Immersion Gold
Solder  mask:Green
Blinded and buried hole: 0.1mm
Min trace width and space: 0.15mm/0.15mm


LayerTypeDelivery time
2 layerSample1day
4 layerSample2days
6 layerSample2days



Technical Capability:

Max layers30 layers
Max panel size600*650mm
Board thicknessCore thickness:0.15-3.20mm,finished board thickness:0.30-6.00mm
Min spacing0.10mm/4mil
Min line width0.10mm/4mil
Min hole0.15mm/6mil
Surface treatmentHAL-lead free,ENIG,OSP,Electrolytic Gold(120 U''),immersion tin,immersion silver,Gold-finger(120 U'' gold thickness)
Minimum pad0.35mm/18mil
Minimum solder mask bridge3mil(0.076mm)
Aspect ratio10:1
Outline tolerance+/-4mil(+/-0.1mm)
Hole Wall Copper Thickness0.025mm/1mil
Warpage<=1.5%
Aperture tolerance±0.05mm/2mil
Thermal Shock288oC,10S,Three times


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