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8L Enig Rigid Board with Rogers Material
Jul 30, 2017

Product Description

Details:
Layer: 8 layer
Finished Board thickness:1.6MM
Board material:Rogers
Brand:Rogers
Tg aility:140
finished Copper thickness:2 oz
Surface treatment: immersion gold
solder mask Colour:Green
Min hole size:0.2mm


LayerTypeDelivery time
2 layerSample board1day
4 layerSample board2days
6 layerSample board2days





Technical Capability:

Max layers30 layers
Max panel size600*650mm
Board thicknessCore thickness:0.15-3.20mm,finished board thickness:0.30-6.00mm
Min spacing0.10mm/4mil
Min line width0.10mm/4mil
Min hole0.15mm/6mil
Surface treatmentHAL-lead free,ENIG,OSP,Electrolytic Gold(120 U''),immersion tin,immersion silver,Gold-finger(120 U'' gold thickness)
Minimum pad0.35mm/18mil
Minimum solder mask bridge3mil(0.076mm)
Aspect ratio10:1
Outline tolerance+/-4mil(+/-0.1mm)
Hole Wall Copper Thickness0.025mm/1mil
Warpage<=1.5%
Aperture tolerance±0.05mm/2mil
Thermal Shock288oC,10S,Three times
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