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Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
M.B: +86-13603055201
TEL: +86-755-26055813
FAX: +86-755-26055946
Email:sales3@xcepcb.com
8 Layer Buried Hole PCB for Electric Cooker, Cooker PCB Manufacturer
Oct 28, 2017

Basic Info

  • Model NO.: pcb-0267

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: XCE

  • Land Area of Our Factory: More Than 10000 Square Meters

  • PCB Layer No.: 1-16

  • Finished Board Thickness: 0.2 mm-3.8mm′(8 Mil-150 Mil)

  • PCB Factory with Certificate: RoHS, ISO9001:2008, SGS, UL

  • Trademark: XCE

  • Specification: TS16949, SGS, ISO14000, REACH, RoHS

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • We Found: in 1998

  • Business Nature: Manufacturing of Printed Circuit Board

  • PCB Cooper Thickness: 0.5 Oz-11oz (18 Um-385 Um)

  • PCB Laminate Materials: Fr-4,Fr-1,,Fr-2,Cem-1,Cem-3

  • Keywords: Cooker PCB

  • Transport Package: Vacuum Packing with Desiccant, Export Carton

  • Origin: Dongguan



Our process capability

PCB DescriptionPCB Capability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Board Max. Size1200mm×600mm
PCB Board Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
PCB Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
PCB Outline ToleranceRouting:±0.1mm (±4mil)  ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB TypeSingle-sided, double-sided, multi-layer
PCB Major MaterialFR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB Thickness0.2-3.5mm
Base Copper Thickness11um  35um  70um  105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10%  2.Hardness:6H  3.bearable friction times :above 200000 times


What we need:

Please tell us the information as below:

Board for what productSurface Finish
Number of LayersBoard Material
Copper Thickness(um)Board Thickness(um)
Solder Mask ColorPCB Dimensions(mm)
Silk Screen ColorMin Finished Hole Size(mm)
MillingMin Clearance(mm)
Min Track Width(mm)Other special requirements


Fast delivery:

PCB PackagingVacuum Packing with desiccant,
Professional Export Carton.
PCB
Delivery
time
 PCB Prototype   Mass production
(above 30m)
2LQuick turn:24h
Usual time:3-4days
5-10days
4LQuick turn:48 hours;
Usual time:5-6days
10-15days
6LQuick turn:72 hours;
Usual time:6-8days
10-20days
8LQuick turn:72 hours;
Usual time:8-10days
15-22days
10LQuick turn:96 hours;
Usual time:12-14days
18-25days
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