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2.4mm HDI High Frequency Precision PCB Circuit Board
Aug 24, 2017

Basic Info

  • Model NO.: xce011104

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: Xce

  • Board Thickness: 2.4mm

  • Surface Finishing: Enig

  • Silkscreen: White

  • Min Hole Size: 0.3mm

  • Transport Package: Vaccume Package

  • Origin: Guangdong, China

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • Tg Value: Tg180

  • Copper Thickness: 2oz

  • Soldermask: Green

  • Min Line W/S: 0.2/0.2mm

  • Trademark: XCE

  • Specification: ROHS

  • HS Code: 8534009000


Specification:
Layer:6
Material type: FR-4-TG180
Board thickness: 2.4 mm
Outer Copper thickness: 2 OZ
Copper thickness in hole :> 25.0 um
Size - Max. Board Size: 23 × 25 (600mm×1000mm)
- Min. Drilled Hole Size: 12mil (0.3mm)
- Min. Line Width: 8mil (0.2mm)
- Min. Line Spacing: 8mil (0.2mm)
Surface finishing :ENIG
Solder Mask Color: Green
Silkscreen: White
PCB Packing - Inner packing: Vacuum packing / plastic Bag
- Outer packing: Standard carton packing
Certificate: UL, ISO 9001, ISO 14001,TS16949
Special requirements: Buried and blind vias+controlled impedance +BGA
Profiling: Punching, Routing, V-CUT, Beveling 






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