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10L Enig High Tg PCB with Blinded/Buried Hole
Aug 25, 2017

Basic Info

  • Model NO.: XCE-D-153

  • Dielectric: FR-4

  • Application: Aerospace

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: XCE

  • Trademark: XCE

  • Specification: RoHS

  • HS Code: 8534001000

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Organic Resin

  • Certificate: UL, RoHS, ISO9001

  • Transport Package: Vacuum

  • Origin: Shenzhen, China


Product Description

1,Details:

Layer10 layers
Board thickness1.6 mm
MaterialFR-4
Material brandNY
Tg value170
Finished copper thickness2 OZ
Surface FinishEnig,yellow
Solder  maskgreen
Min. hole size0.2mm
Min. line  width/space3/3 mil
E-Test100%



 
single side2 layer4 layer6 layer8 layer10 layer12 layer
prototype0.5-3 days0.5-41.5-52-63-74-84-9
bulk production3-54-75-95-96-106-107-11


Technical Capability:

Max layers30 layers
Max panel size600*650mm
Board thicknessCore thickness:0.15-3.20mm,finished board thickness:0.30-6.00mm
Min spacing0.10mm/4mil
Min line width0.10mm/4mil
Min hole0.15mm/6mil
Surface treatmentHAL-lead free,ENIG,OSP,Electrolytic Gold(120 U''),immersion tin,immersion silver,Gold-finger(120 U'' gold thickness)
Minimum pad0.35mm/18mil
Minimum solder mask bridge3mil(0.076mm)
Aspect ratio10:1
Outline tolerance+/-4mil(+/-0.1mm)
Hole Wall Copper Thickness0.025mm/1mil
Warpage<=1.5%
Aperture tolerance±0.05mm/2mil
Thermal Shock288oC,10S,Three times





 

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