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10 Layer Enig PCB Board Impedance Control+Resin Plugging
Aug 05, 2017

Basic Info

  • Model NO.: XCE-003

  • Dielectric: FR-4

  • Application: Solid State Drive/Disk

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: Shengyi,Jb,Grace

  • Inner Layer Line Width/Space: 5/3.5mil

  • Origin: Shenzhen, China

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • Minimum Hole: 0.25mm

  • Outer Layer Line Width/Space: 4/4mil

  • Transport Package: Vacuum Package in Cartons

  • HS Code: 8534009000



Specification:

Layer10
MaterialFR4, Impedance Control, Resin Plugging,Unbalance Copper
Board Thickness2.0mm
Copper Thickness1oz
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion Gold
Min Hole Size0.25mm
Aspect Ratio8:1


Technical Capabilities & Lead Time:

ItemsTechnical Capabilities
Base MaterialsRogers,Taconic,Arlon Materials
Maximum Size500mm*800mm
Dimension Accuracy±0.1mm
Thickness Range0.20-6.00mm
Thickness Tolerance(THK≥0.8mm)±8%
Thickness Tolerance(THK<0.8mm)±10%
Dielectric Thickness0.07-5.00mm
Minimum Line Width0.075mm
Minimum Space0.075mm
Outer Copper Thickness35-280um
Drill Hole (Mechanical)0.15-6.35mm
Finished Hole(Mechanical)0.10-6.30mm
Diameter Tolerance (Mechanical)±0.075mm
Hole Position Tolerance±0.05mm
Aspect Ratio13:1
Soler Mask TypeLPI
Minimum Solder Bridge Width0.08mm
Minimum Solder Mask Clearance0.05mm
Plug Hole Diameter0.25-0.60mm



Lead Time :

CategoryQuickest Lead TimeStandard Lead Time
2 Layers24 hours96 hours
6 Layers48 hours120 hours
8 Layers72 hours144 hours
10 Layers96 hours192 hours
12 Layers120 hours240 hours
14 Layers120 hours288 hours
≥16 Layers144 hours336 hours


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