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Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
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TEL: +86-755-26055813
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Email:sales3@xcepcb.com
10-Layer Multilayer 2.6mm PCB for Power Supply
Sep 30, 2017

Basic Info

  • Model NO.: XCEPCB

  • Dielectric: FR-4

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • Brand: XCE

  • Board Thickness: 2.6mm

  • Surface Finishing: Lead Free Hal+Enig

  • Silkscreen: White

  • Min Hole Size: 0.4mm

  • Transport Package: Vacunm Packing

  • Origin: Shenzhen

  • Type: Rigid Circuit Board

  • Material: Rogers 4535

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Model: FR-4

  • Tg Value: Tg180

  • Copper Thickness: 3oz

  • Soldermask: Green

  • Min Line W/S: 4/4 Mil

  • Trademark: XCE

  • Specification: CE, RoHS, SGS

  • HS Code: 8534009000


Specification:

Layer  10
MaterialFR4-TG 180
Board Thickness2.6mm
Copper Thickness3oz
SoldermaskGreen 
SilkscreenWhite
Surface FinishingLead Free HAL+ENIG
Min Line Width/Space4/4 mil
Min Hole Size0.4mm



 

Why US:

  • UL (E246887), ISO9001, TS16949, ISO 14001 certified.

  • Turnover USD 50-100 million per year

  • 25,000 sqm area,1100 staff 

  • Produce from single to 20 layers 

  • Special Material: ROGERS, Arlon, Taconic.etc.




 

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