China Multilayer PCB Factory, China PCB Supplier, China PCB Exporter manufacturer / supplier in China, offering Multilayer PCB Main Board PCB Gold Platting PCB 6layer PCB, Double Sided PCB 2layer PCB 4oz Copper Red Mask Enig PCB, LED Aluminum PCB Single Sided PCB 1layer Aluminum LED PCB Taiyo Wihite Mask PCB and so on.
Basic Info
Type:Rigid Circuit Board
Dielectric:FR-4
Material:Fiberglass Epoxy
Flame Retardant Properties:V0
Finished Copper Thickness: 35umm:Min Track Width: 0.1mm
Min Track Space:0.1mm:Surface Treatment: Gold Plating
Trademark:XCE
Specification:UL, CE, ROHS, SGS, ISO9001
Origin:Shenzhen of China
HS Code:8534009000
Product Description
We can produce the following process of circuit board:
Material: Rogers,CEM-1, CEM-3, FR4(TG130-170)\Flexible, Aluminum based, Heavy copper ect
Surface Treatment: HASL, LEAD-FREE, Immersion Gold, Gold Plating, OSP, Immersion Tin, Immersion Silver
Layer count: 1-10
Board Thickness: 0.4mm-3.2mm
Copper Thickness: 17um-140um
Min conductor width: 0.1mm
Min conductor spacing: 0.1mm
Impedance Tolerance: +/-10%
Profiling Tolerance: +/-0.1mm
We should be highly appreciated to your early reply.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
