Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
PCB for LED, Multilayer PCB, Printed Circuit Board manufacturer / supplier in China, offering Multi Layer PCB with 2-18 Layers, in Shenzhen PCB Factory, Rigid PCB in Shenzhen PCB Factory with PCB Design Service, Rigid Flex PCB, Rigid Flexible PCB in Shenzhen PCB Factory with OEM Service and so on.
Type:Rigid Circuit Board
Flame Retardant Properties:V0
Processing Technology:Electrolytic Foil
Insulation Materials:Epoxy Resin
Number of layers: 4-Layer
Base material: FR-4, aluminum, copper, ceramic and others
Copper thickness: 1oz
Board thickness: 0.2mm-1.6mm
Minimum hole size: 0.3mm
Minimum line width: 0.2mm
Minimum line spacing: 0.2mm
Surface finishing: OPS, HASL, immersion gold/silver, selected gold, carbon ink
Product type: PCB
Color: green, black, blue
Certificate: ETL\CE\UL\SGS\FCC\Rohs certificate
Board type: rigid, flexible, rigid-flexible
AU thickness: 0.015mm-0.025mm
Peel strength: 1.4N/mm
Board cutting: shear, V-score, tab-routed
Maximum panel size: 800mm*508mm
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.