Home > Products > Multilayer PCB

Product Categories

CONTACT US
Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
M.B: +86-13603055201
TEL: +86-755-26055813
FAX: +86-755-26055946
Email:sales3@xcepcb.com

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit XCE PCB technical specification Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free Layer No. 1-16 Min board thickness 2 layer 0.2mm 4 layer 0.4mm 6 layer 0.6mm 8 layer 0.8mm 10...

Chat Now
Product Details

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

XCE PCB technical specification

Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free

Layer No. 1-16

Min board thickness 2 layer 0.2mm

4 layer 0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm

Board thickness tolerance T≥0.8mm±8%,T<0.8mm±5%

Wall hole copper thickness >0.025mm(1mil)

Finished hole 0.2mm-6.3mm

Min line width 4mil/4mil(0.1/0.1mm)

Min bonding pad space 0.1mm(4mil)

PTH aperture tolerance ±0.075mm(3mil)

NPTH aperture tolerance ±0.05mm(2mil)

Hole site deviation ±0.05mm(2mil)

Profile tolerance ±0.10mm(4mil)

Board bend&warp ≤0.7%

Insulation resistance >1012Ωnormal

Through-hole resistance <300Ωnormal

Electric strength >1.3kv/mm

Current breakdown 10A

Peel strength 1.4N/mm

Soldmask regidity >6H

Thermal stress 288℃20Sec

Testing voltage 50-300v

Min buried blind via 0.2mm(8mil)

Outer cooper thickness 1oz-5oz

Inner cooper thickness 1/2 oz-4oz

Aspect ratio 8:1

SMT min green oil width 0.08mm

Min green oil open window 0.05mm

Insulation layer thickness 0.075mm-5mm

Aperture 0.2mm-0.6mm

Special technology Inpedance,blind buried via,thick gold,aluminumPCB

Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Main Export Markets:

Asia

Australasia

Central/South America

Eastern Europe

Mid East/Africa

North America

Western Europe

Specification:

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

Green Soldermask White Silkscreen,

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,

with electronic level glass fiber cloth as reinforcing material of substrate.

Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material

in production of multilayer printed circuit board,

This kind of product is mainly used for double-sided PCB, dosage is very large.

Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,

in recent years because of the electronic product installation technology

and PCB technology development needs, appeared high Tg FR - 4 products.

 

Advantage Highlights

Specialized in 2- to 32-layer PCB

ISO 9001-, ISO 14001- and ISO/TS 16949-certified

Products are UL- and RoHS-certified

Partner for over 2000 small- and medium-scale customers

Two factory bases totaling 22,000 square meters

Less than 12-hours quick response to inquiries

Widely acclaimed and satisfying services

Over 66% of PCBs are exported to international markets


Parameter:

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling


Product Feature:

1. OEM&ODM are availble, different shape for your choice

2. Programmable, it can change different colors and lighting ways

3. Green and Energy saving, best for your lighting project


Why choose us

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, any your customized lightings we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information


Trade Terms

1. Payment: T/T in advance (Western Union is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shenzhen, Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PC









Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you immersion gold multilayer pcb circuit board micro via holes battery protection circuit with competitive price. Just be free to buy good immersion gold multilayer pcb circuit board micro via holes battery protection circuit at reasonable price with us and get the datasheet from our suppliers who can working for you.
Hot Tags: immersion gold multilayer pcb circuit board micro via holes battery protection circuit manufacturer, suppliers, factory, datasheet, buy, price
Related Products
Quick Navigation
  • About Us
  • Products
  • News
  • Exhibition
  • Contact Us
  • Capability
  • Newsletter
    Enter in your email address to receive deals and coupons.
    +86-755-26055813
    +86-755-26055946 sales3@xcepcb.com
    http://cs.ecqun.com/mobile/rand?id=3826129