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High TG Black Soldermask Prototype Multi Layer Pcb Laser Drill Communicate Electronics Board

High TG Black Soldermask Prototype Multi Layer Pcb Laser Drill Communicate Electronics Board

High TG Black Soldermask Prototype Multi Layer Pcb Laser Drill Communicate Electronics Board Key Specifications/Special Features: Multilayer ceramic PCBs PCBs material: FR-4, 0.5oz - 6oz copper 0.45 to 3.2mm thickness Minimum line width and line spacing: 4mil/4mil Minimum hole diameter: 0.2mm...

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Product Details

High TG Black Soldermask Prototype Multi Layer Pcb Laser Drill Communicate Electronics Board

Key Specifications/Special Features:

Multilayer ceramic PCBs

PCBs material: FR-4, 0.5oz - 6oz copper

0.45 to 3.2mm thickness

Minimum line width and line spacing: 4mil/4mil

Minimum hole diameter: 0.2mm

Maximum panel size: 480 x 580mm

Surface finishing:

HAL, alpha level, gold plating, ENTech

HAL or tin and gold plating

Solder mask type: liquid photoimageable solder mark

Precision V-cut or routing for panel form design

OEM orders for SMT and A/I assembly projects accepted

Gerber file preferred

Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotations

We will offer our best prices if you can send your own PCB design

 

Product Details:

Place of Origin:China

Brand Name:XCE

Certification:CE,ROHS, FCC,ISO9008,SGS,UL

Model Number:XCEH

Minimum Order Quantity:1pcs

Price:negotiation

Packaging Details:inner: vacuum-packed bubble bag outer: carton box

Delivery Time:5-10 days

Payment Terms:T/T,Western union

Supply Ability:1, 000, 000 PCS / week

 

Advantage Highlights

Specialized in 2- to 32-layer PCB

ISO 9001-, ISO 14001- and ISO/TS 16949-certified

Products are UL- and RoHS-certified

Partner for over 2000 small- and medium-scale customers

Two factory bases totaling 22,000 square meters

Less than 12-hours quick response to inquiries

Widely acclaimed and satisfying services

Over 66% of PCBs are exported to international markets


Parameter:

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling


Benefits:

High dielectric constant for circuit size reduction

Low loss. Ideal for operating at X-band or below

Tight εr and thickness control for repeatable circuit performance

Typical Applications:

Space Saving Circuitry

Patch Antennas

Satellite Communications Systems

Power Amplifiers

Aircraft Collision Avoidance Systems

Ground Radar Warning Systems

Competitive Advantage:

1) With UL,ROHS,ISO,IPC

2).Lead time:3-10 working days

3)Competitive price best quality

4)Rich 20 years experience in High Tg Multilayer PCB


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