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6 Layers PCB with Half Holes Plated

6 Layers PCB with Half Holes Plated

6 Layers, PCB, Multilayer PCB manufacturer / supplier in China, offering 6 Layers PCB with Half Holes Plated, 8 Layers PCB with BGA and Golden Fingers, Single Sided Flexible PCB and so on.

Product Details


Product Detail

Basic Info

  • Model NO.:XCE-032

  • Type:Rigid Circuit Board

  • Dielectric:FR-4

  • Material:Fiberglass Epoxy

  • Application:Communication

  • Flame Retardant Properties:V0

  • Mechanical Rigid:Rigid

  • Processing Technology:Electrolytic Foil

  • Base Material:Copper

  • Insulation Materials:Epoxy Resin

Product Description

6 layers pcb with half holes plated
Minimum line width/space: 6mils
Surface finish: immersion gold
Board thickness: 1.00MM
Minimum drilled hole diameter: 8mils
Copper thickness: 1oz
Min BGA size : 0.35MM
Special process : half holes plated 


FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.


The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.

Testing procedures for PCB board:

We perform multiple quality assuring procedures before shipping out any PCB board

These include:

Visual inspection

Flying probe

Impedance control

Solder ability detection

Digital metallogenic microscope

AOI (automated optical inspection)

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