6 Layers Multi-Layer PCB, Multi-Layer PCB, PCB manufacturer / supplier in China, offering 6 Layers Multi-Layer PCB, 14L Multilayer PCB with Gold Finger, 2 Layers PCB and so on.
Model NO.:As request
Type:Rigid Circuit Board
High Density PCB:Multi-Layer PCB
High Density Interconnect Pcbs (HDI Pcbs:Multilayer PCB
HDI Board:Aluminum PCB
HDI PCB:Aluminium PCB
Micro Via PCB:Metal Base PCB
Blind Via PCB:Flex-Rigid PCB
Buried Vias PCB:Rigid-Flex PCB
Mobile Main Board:Flexible PCB
High Density Printed Circuit Board (PCB):Impedance Control PCB
High Density Board:Heavy Copper Power PCB
Specification:ISO9001, UL, RoHS
6L multilayer printed circuit board
Material: FR-4 Tg170
Board thickness: 1.58mm
Surface finished: Immersion gold
Copper thickness: 1 Oz for all layers
Min.line width/space: 5mil
Min through hole: 0.2mm
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.