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6 Layers Multi-Layer PCB

6 Layers Multi-Layer PCB

6 Layers Multi-Layer PCB, Multi-Layer PCB, PCB manufacturer / supplier in China, offering 6 Layers Multi-Layer PCB, 14L Multilayer PCB with Gold Finger, 2 Layers PCB and so on.

Product Details

                          

Product Detail

Basic Info

  • Model NO.:As request

  • Type:Rigid Circuit Board

  • Dielectric:FR-4

  • Application:Medical Instruments

  • Mechanical Rigid:Rigid

  • Brand:Hitech Circuits

  • High Density PCB:Multi-Layer PCB

  • High Density Interconnect Pcbs (HDI Pcbs:Multilayer PCB

  • HDI Board:Aluminum PCB

  • HDI PCB:Aluminium PCB

  • Micro Via PCB:Metal Base PCB

  • Blind Via PCB:Flex-Rigid PCB

  • Buried Vias PCB:Rigid-Flex PCB

  • Mobile Main Board:Flexible PCB

  • High Density Printed Circuit Board (PCB):Impedance Control PCB

  • High Density Board:Heavy Copper Power PCB

  • Trademark:XCE

  • Specification:ISO9001, UL, RoHS

  • Origin:China, Shenzhen

  • HS Code:8479909090



Product Description

 6L multilayer printed circuit board
        Technical description, 
        Material: FR-4 Tg170
        Board thickness: 1.58mm 
        Surface finished: Immersion gold 
        Copper thickness: 1 Oz for all layers 
        Min.line width/space: 5mil
        Min through hole: 0.2mm 

       

Specification:

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.

 

The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.




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