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Making PCB Samples/Design/Copy/Fr4/Hightg

Making PCB Samples/Design/Copy/Fr4/Hightg

Circuit Board, Pcb, Print Board manufacturer / supplier in China, offering Making PCB Samples/Design/Copy/Fr4/Hightg, Atos E-Mi-AC-01f, Aop, Mps, --Adapt, Advance Osmotic Pulse The Wall Dry Machine and so on.

Product Details

                                    


Product Detail

Basic Info

  • HS Code:8534009000

Typical Applications

Cellular Base Station Antennas and Power Amplifiers

Microwave point to point (P2P) links

Automotive Radar and Sensors

low dielectric loss

Ballast, lights, navigation

The stability of the dielectric constant

An extremely low water imbibition

IT industry,Keyboard products

FR-4 epoxy glass Burkina board, based on epoxy resin as the binder, the electronic-grade glass fiber cloth as a reinforcing material-based substrate. Its bonding sheet and the inner core thin CCL is an important base of manufacturing a multilayer printed circuit board.

 

Parameter:

oItemData

1Layer:1 to 24 layers

2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

3Board thickness:0.20mm to 3.4mm

4Copper thickness:0.5 OZ to 4 OZ

5Copper thickness in hole:>25.0 um (>1mil)

6Max. Board Size: (580mm×1200mm)

7Min. Drilled Hole Size:4mil(0.1mm)

8Min. Line Width:3mil (0.075mm)

9Min. Line Spacing:3mil (0.075mm)

10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

11Solder Mask Color:Green/Yellow/Black/White/Red/Blue

12Shape tolerance: ±0.13

13Hole tolerance: PTH: ±0.076 NPTH: ±0.05

14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing

15Certificate:UL,SGS,ISO 9001:2008

16Special requirements:Buried and blind vias+controlled impedance +BGA

17Profiling:Punching, Routing, V-CUT, Beveling


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