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6-Layer Mobile Phone Application PCB

6-Layer Mobile Phone Application PCB

6-Layer Pcbs, Multilayer FPCB, FPCB manufacturer / supplier in China, offering 6-Layer Pcbs, Mobile Phone Application, Double-Sided Flexible PCB, 100% Electrical Tested, Volume Flexibility, UL Mark, Double-Sided Flexible PCB, CCD Camera Module Application, with Pet Stiffener and so on.

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Product Details

Product Detail

Basic Info

  • Model NO.:XCE0119

  • Type:Flexible Circuit Board

  • Dielectric:FR-4

  • Material:Paper Phenolic Copper Foil Substrate

  • Flame Retardant Properties:V1

  • Mechanical Rigid:Fexible

  • Processing Technology:Delay Pressure Foil

  • Base Material:Copper

  • Insulation Materials:Epoxy Resin

  • Model:FR-4

  • Brand:XCE


FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.


The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.


? High Thermal Performance

? Tg: 180°C (DSC)

? Td: 340°C (TGA @ 5% wt loss)

? Low CTE for reliability

? T260: 60 minutes

? T288: 30 minutes

? RoHS Compliant

? UV Blocking and AOI Fluorescence

? High throughput and accuracy during PCB

fabrication and assembly

? Superior Processing

? Closest to conventional FR-4 processing

? Core Material Standard Availability

? Thickness: 0.002″ (0.05 mm) to 0.125″

(3.2 mm)

? Available in full size sheet or panel form

? Prepreg Standard Availability

? Roll or panel form

? Tooling of prepreg panels available

? Copper Foil Type Availability

? Standard HTE Grade 3

? RTF (Reverse Treat Foil)

? Copper Weights

? ?, 1 and 2 oz (18, 35 and 70 μm) available

? Heavier copper available upon request

? Thinner copper foil available upon request

? Glass Fabric Availability

? Standard E-glass

? Square weave glass fabric available

? Spread glass fabric available

? Industry Approvals

? IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126

? UL - File Number E41625 as PCL-FR-370HR

? Qualified to UL's MCIL Program

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