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TG150 4 Layer Immersion Tin PCB Board In Ink Plugging Hole With 2 Prepregs

TG150 4 layer Immersion Tin pcb board in Ink plugging hole with 2 Prepregs Ink plugging hole is surface mount technology production requirements of printed circuit board with a special process. It uses screen printing method by plugging ink-sided and multilayer printed circuit board vias become...

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Product Details

 TG150 4 layer Immersion Tin pcb board in Ink plugging hole with 2 Prepregs

 

Ink plugging hole is surface mount technology production requirements of printed circuit board with a special process. It uses screen printing method by plugging ink-sided and multilayer printed circuit board vias become blind through holes, the production technology is the solder stencil printing ink is printed through the drain into the pores, and then the use of capillary suction fill the hole so that the role of the structure of the ink column, completely blocked vias.

 

Immersion tin process is for the benefit of SMT chip package with specially designed surface of the copper chemically deposited tin metal coating, to replace a green new technology Pb-Sn alloy coating manufacturing process, and has been widely used electronic products ( such as circuit boards, electronic devices) and hardware, accessories, and other surface treatment.

 

Immersion tin process characteristics

1.Bake at 155 ℃ 4 hours (which is equivalent to storing a year), or by eight days of high temperature and humidity test (45 ℃, relative humidity 93%), still has excellent solderability after reflow or thrice sex;

2. immersion tin layer is smooth, flat, dense, difficult to form than the tin plating copper-tin intermetallic compounds, tin whisker;

3. Immersion tin layer thickness of up to 0.8-1.5μm, lead-free solder can withstand repeated shocks;

4. The solution is stable, the process is simple, and can be supplemented by analysis of continuous use without replacing the cylinder;

5. The process is also suitable both for vertical for horizontal processes;

6. Immersion tin cost far less than ENIG, HASL and fairly;

7. For HAL easily short-circuited HDF has a clear technological advantage, suitable for high-density IC packaging thin rigid board and flexible board;

8. suitable for surface mount (SMT) or laminated (Press-fit) installation process;

9. Lead-free fluorine-free, pollution-free environment, free recycling waste.

 



Model Number:XCEPCB0017    

Shipping port:ShenZhen/HongKong          

Place of origin:GuangDong,China    

Delivery Time:3-10 Working Days  

Production capacity:FR4:2000000Sqms   High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union

Certification:CE,ROHS,FCC,ISO9008,SGS,UL

 

 

Material:FR4

Soldermask:Green

Molde Number:xcepcb0017

Silkscreen:White

Layer:4

Panel Size:85*85mm

Board Thickness:1.6mm

Package Details:

Inner:Vacuum-packed

     Bubble bag

     With Foam

Outer:Carton Box

Min Line Space:4Mil

Min Line Width:4Mil

Min Hole Size:10Mil

Finished Surface:Immersion Tin

Special requirement:

Immersion Tin

Ink plugging hole

Provide Slice report

Finished Copper:1oz

Delivery Time6 Days



Typical Applications

Cellular Base Station Antennas and Power Amplifiers

Microwave point to point (P2P) links

Automotive Radar and Sensors

low dielectric loss

Ballast, lights, navigation

The stability of the dielectric constant

An extremely low water imbibition

IT industry,Keyboard products

 

11图片1.png2图片1.png


Parameter:

o

Item

Data

1

Layer:

1 to 24 layers

2

Material type:

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

3

Board thickness:

0.20mm to 3.4mm

4

Copper thickness:

0.5 OZ to 4 OZ

5

Copper thickness in hole:

>25.0 um (>1mil)

6

Max. Board Size:

 (580mm×1200mm)

7

Min. Drilled Hole Size:

4mil(0.1mm)

8

Min. Line Width:

3mil (0.075mm)

9

Min. Line Spacing:

3mil (0.075mm)

10

Surface finishing:

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

CNC Functions

Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250” Spacing Milling
30 or 60 Degree Score Angle Blind and

Buried Vias


30 to 100 Degree Countersink Controlled 

Z Axis Route


15 to 45 Degree Gold Finger Bevel 

Castellated Barrels


Counterbores Offset or Recessed Beveling
Plated Countersinks


Other PCB Services

Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps 

(Solder Mask)
Conductive Filled Vias


Quality / Testing

Inspect to IPC Class III Continuity Resistance

 – 10 to 20 Ohms
Net List Test per IPC-356D Isolation 

Resistance

 – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum

SMT Pitch 0.5 mm


Tolerances

PTH Hole Size – +/- .002”
Front to Back – +/- .002”
NPTH Hole Size – +/- .001”
Solder Mask – +/- .002”
Tooling Holes – +/- .001”
Hole to Pad – +/- .005”


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 

Double-sided-ROGERS-PCBs (1).jpg 



What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

Contact Information:

Karen-Sales Department

ShenZhen Xinchenger Electronic Co.,Ltd

Email:sales3@xcepcb.com

Tel:0755-26055813

Fax:0755-26055946

Skype:karen-xcepcb

 


Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you tg150 4 layer immersion tin pcb board in ink plugging hole with 2 prepregs with competitive price. Just be free to buy good tg150 4 layer immersion tin pcb board in ink plugging hole with 2 prepregs at reasonable price with us and get the datasheet from our suppliers who can working for you.

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