HDI High TG 24 multilayer immerison gold Inner 0.5oz outer 1oz PCB board Multilayer future development trend: 1.High density 2.Thin poly (high) level of 3.Diversification multilayer structure 4.High performance thin substrate of thin copper box 5.Board high flatness and surface coating...
HDI High TG 24 multilayer immerison gold Inner 0.5oz outer 1oz PCB board
Multilayer future development trend:
2.Thin poly (high) level of
3.Diversification multilayer structure
4.High performance thin substrate of thin copper box
5.Board high flatness and surface coating technology
6.Multilayer flexible and rigid-flex multilayer
v Fast PCB Fabrication for Samples and Mass Production
v Electronic Components Sourcing Services
v PCBA Assembly Services:SMT,DIP,BGA...
v Function Test
v Stencil,Cable and Enclosure Assembly
v Reverse engineering service
v Standard Packing and On time Delivery
Place of origin:GuangDong,China
Delivery Time:3-10 Working Days
Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms
Minimum Order Quantity:1pc
Payment terms:TT,Paypal,Western Union
Min Line Space:4Mil
Min Line Width:4Mil
Min Hole Size:12Mil
Provide Slice report
Provide shipment report
Delivery Time：8 Days
Xinchenger Electronics co.,Ltd established in 2002,we have commited ourselves to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production.
we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.
Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.
With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.
Company spirit:Customer first,openness basing on sincerity.
Comapny culture:Improve employees quality with on the job training.
Quality policy:Honesty,superior quality,high efficiency.
Company tenet: Provide customers with satisfactory products and service is our eternal tenet.
Layer count:1-24 layers
Min. Core Thickness:0.075mm
Min. Drill Size:0.2mm
Max. Aspect Ratio: 8:1
Min. Trace Width: 0.1mm
Min line spacing:0.075mm
Min. SMT/QFP Pitch:0.4mm
No. of Layer
Up to 40 layers
FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg
RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers
CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base
Min. Hole Spacing
PTH (Plated Through Hole)
NPTH (Non Plated Through Hole)
HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver
Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.
Special Processing Board
Copper plate edge, Sink hole, Tear ink, FPC
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
ShenZhen Xinchenger Electronics Co.,Ltd
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you hdi high tg 24 multilayer immerison gold inner 0.5oz outer 1oz pcb board with competitive price. Just be free to buy good hdi high tg 24 multilayer immerison gold inner 0.5oz outer 1oz pcb board at reasonable price with us and get the datasheet from our suppliers who can working for you.