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BGA 14 Layer Electronic Board For Electronic Products In Green Soldermask

Solt hole BGA 14 layer electronic board for electronic products in green soldermask Slots: Slots is actually in production drilling rig program is automatically converted to a collection of more than a single hole. Generally 1.5 times the diameter of the slot, will drill seven times....

Product Details

 Solt hole BGA 14 layer electronic board for electronic products in green soldermask

 

Slots: Slots is actually in production drilling rig program is automatically converted to a collection of more than a single hole. Generally 1.5 times the diameter of the slot, will drill seven times.

 

Specification:

Model

XCEM

Layer

14

Brand

XCE

Board THK

1.6MM

Surface finish

Immersion gold

Size

303*55mm

Copper THK

1.5oz

Origin

Shenzhen

Parameter:

No. of Layer

Up to 40 layers

Material

FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg

RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers

CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base

Min. Width/Spacing

50um/50um

Copper Thickness

1/3~12oz (12~420um)

Thickness

0.1~6.0mm (0.004’’~0.240’’)

Min. Hole Spacing

PTH (Plated Through Hole)

0.10mm (0.004’’)

NPTH (Non Plated Through Hole)

0.10mm (0.004’’)

Surface Finish

HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver

Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.

Special Processing Board

Copper plate edge, Sink hole, Tear ink, FPC

BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT solder paste to the circuit board is connected. Their differences are listed in the surrounding "space was the" single-row pin, such as gull wing room to move, room to move flat or retracted abdomen and foot end of the J-; changed to the bottom belly full array or an array of local, the adoption of a two dimensional area of the solder ball pinout, as the chip package on the circuit board solder interconnection tools. It has an area of less packaging, increased functionality, increased pin count, high reliability, good electrical properties, low overall cost.

 

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The outer line of the BGA production:

BGA can refer to specifications, design pad size corresponding to the position of a customer to make a standard design BGA BGA array, and then as its benchmarks to be corrected under the BGA and BGA vias were being shot, to be filmed after the original is not shoot before the backup check the level of contrast before and after being shot effect, if BGA pad around large deviations, can not only beat BGA position over the next hole.


Model Number:XCEPCB0021   

Shipping port:ShenZhen/HongKong          

Place of origin:GuangDong,China    

Delivery Time:3-10 Working Days  

Production capacity:FR4:2000000Sqms   High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union

Certification:CE,ROHS,FCC,ISO9008,SGS,UL


Material:FR4

Soldermask:Blue

Molde Number:xcepcb0021

Silkscreen:White

Layer:14

Panel Size:303*55mm

Board Thickness:1.6mm

Package Details:

Inner:Vacuum-packed

     Bubble bag

     With Foam

Outer:Carton Box

Min Line Space:4Mil

Min Line Width:4Mil

Min Hole Size:10Mil

Finished Surface:ENIG

Special requirement:

BGA

Slot holes

Provide Slice report

Finished Copper:1.5oz

Delivery Time8 Days


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Shenzhen Xinchenger Electronics was a leading manufacturer of high frequency and high difficult pcb circuit board for many years in shenzhen.We have newest pcb machine like laser drill machine,can do min2mil line space and width for you.

 

With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.

Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English.


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

设备展示_副本.jpg


Contact Information:

Karen-Sales Department

ShenZhen Xinchenger Electronic Co.,Ltd

Email:sales3@xcepcb.com

Tel:0755-26055813

Fax:0755-26055946

Skype:karen-xcepcb

 


Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you bga 14 layer electronic board for electronic products in green soldermask with competitive price. Just be free to buy good bga 14 layer electronic board for electronic products in green soldermask at reasonable price with us and get the datasheet from our suppliers who can working for you.

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