Home > Products > Multilayer PCB > 12-36 Layer PCB

Product Categories

CONTACT US
Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
M.B: +86-13603055201
TEL: +86-755-26055813
FAX: +86-755-26055946
Email:sales3@xcepcb.com

16 Multilayer Metal Hole PCB Board With 8mil Min Line Width In Green Soldermask

16 multilayer metal hole PCB board with 8mil min line width in green soldermask pp sheet is a prepreg (Prepreg is Pre-pregnant abbreviation), is a synthetic resin with the carrier sheet adhesive material. A. resin - is a thermosetting material for polymers, currently used as an epoxy resin. It...

Product Details

  16 multilayer metal hole PCB board with 8mil min line width in green soldermask

 

pp sheet is a prepreg (Prepreg is Pre-pregnant abbreviation), is a synthetic resin with the carrier sheet adhesive material. A. resin - is a thermosetting material for polymers, currently used as an epoxy resin. It has three life cycle to meet the requirements of the platen: A-Stage: brominated Bisphenol + epichlorohydrin liquid epoxy resin for the A-Stage, also known as varnish (Varnish). B-Stage: with glass fiber sizes in A-stage resin, after hot air or infrared drying, partial polymerization, into a solid film, called B-Stage.

 

BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT solder paste to the circuit board is connected. Their differences are listed in the surrounding "space was the" single-row pin, such as gull wing room to move, room to move flat or retracted abdomen and foot end of the J-; changed to the bottom belly full array or an array of local, the adoption of a two dimensional area of the solder ball pinout, as the chip package on the circuit board solder interconnection tools. It has an area of less packaging, increased functionality, increased pin count, high reliability, good electrical properties, low overall cost.

 

The outer line of the BGA production:

BGA can refer to specifications, design pad size corresponding to the position of a customer to make a standard design BGA BGA array, and then as its benchmarks to be corrected under the BGA and BGA vias were being shot, to be filmed after the original is not shoot before the backup check the level of contrast before and after being shot effect, if BGA pad around large deviations, can not only beat BGA position over the next hole.

 

图片1.png


 

Model Number:XCEPCB0016   

Shipping port:ShenZhen/HongKong          

Place of origin:GuangDong,China    

Delivery Time:3-10 Working Days  

Production capacity:FR4:2000000Sqms   High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union

Certification:CE,ROHS,FCC,ISO9008,SGS,UL

 

Material:FR4

Soldermask:Green

Molde Number:xcepcb0016

Silkscreen:White

Layer:16

Panel Size:300*205mm/5pcs

Board Thickness:1.6mm

Package Details:

Inner:Vacuum-packed

     Bubble bag

     With Foam

Outer:Carton Box

Min Line Space:8Mil

Min Line Width:8Mil

Min Hole Size:18Mil

Finished Surface:ENIG

Special requirement:

BGA

Prepreg

Provide Slice report

Finished Copper:1oz

Delivery Time8 Days


201608301659531702662.jpg



Shenzhen Xinchenger Electronics was a leading manufacturer of high frequency and high difficult pcb circuit board for many years in shenzhen.We have newest pcb machine like laser drill machine,can do min2mil line space and width for you.

 

With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.

Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English.

 

 

Via Hole ", ie, vias, refers to a multilayer circuit board only as a hole between the layers conductive interconnect applications, generally no longer used for welding parts of the foot insert Such holes through the" Shen copper "step in the hole plated with a layer of copper for conductivity.

 

These vias penetrating the entire board "all through vias" (Through Via Hole), have turned to the board only without all through "blind vias" (Blind Via Hole), there is no contact with the plate surface Tong was buried in the inside of the plate, "buried through holes" (buried Via hole) and the like. These complex partial vias is sequentially continuous legal pressure (Sequential Lamination) produced complete. This term is also often referred to as "Via".

 

The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)

Yellow and white core plate divided core material, usually white core material;

Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";

Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;

Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;

TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)

CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);

Dielectric constant (Er): general value 4.2-4.5;

Thermal decomposition temperature (TD): typ. 305 ℃;

 

 

Parameter:

Layer No.

1-16

Min board thickness

2 layer 0.2mm

4 layer 0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size

508*610mm

Board thickness tolerance  

T≥0.8mm±8%,T0.8mm±5%

Wall hole copper thickness  

0.025mm(1mil)

Finished hole

0.2mm-6.3mm

Min line width

4mil/4mil(0.1/0.1mm)

Min bonding pad space

0.1mm(4mil)

PTH aperture tolerance

±0.075mm(3mil)

NPTH aperture tolerance

±0.05mm(2mil)

Hole site deviation

±0.05mm(2mil)

Profile tolerance

±0.10mm(4mil)

Board bend&warp

≤0.7%

Insulation resistance

1012Ωnormal

Through-hole resistance

300Ωnormal

Electric strength

1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity

6H

Thermal stress

288℃20Sec

Testing voltage

50-300v

Min buried blind via

0.2mm(8mil)

Outer cooper thickness

1oz-5oz

Inner cooper thickness

1/2 oz-4oz

Aspect ratio

8:1

SMT min green oil width

0.08mm

Min green oil open window

0.05mm

Insulation layer thickness

0.075mm-5mm

Aperture

0.2mm-0.6mm


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

Contact Information:

Karen-Sales Department

ShenZhen Xinchenger Electronics Co.,Ltd

sales3@xcepcb.com

Skype:karen-xcepcb

Website:www.fr4-pcb.com/www.xce-pcb.com


Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you 16 multilayer metal hole pcb board with 8mil min line width in green soldermask with competitive price. Just be free to buy good 16 multilayer metal hole pcb board with 8mil min line width in green soldermask at reasonable price with us and get the datasheet from our suppliers who can working for you.

Hot Tags: 16 multilayer metal hole PCB board with 8mil min line width in green soldermask manufacturer, suppliers, factory, datasheet, buy, price, 26 layer pcb
Quick Navigation
  • About Us
  • Products
  • News
  • Exhibition
  • Contact Us
  • Capability
  • Newsletter
    Enter in your email address to receive deals and coupons.
    +86-755-26055813
    +86-755-26055946 sales3@xcepcb.com
    http://cs.ecqun.com/mobile/rand?id=3826129