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14 Layer Bule Soldermask 300265mm ENIG Multilayer Customized PCB Board

14 layer bule soldermask 300*265mm ENIG multilayer customized PCB board Parameter: 14 layer bule soldermask 300*265mm ENIG multilayer customized PCB board: BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT...

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Product Details

 14 layer bule soldermask 300*265mm ENIG multilayer customized PCB board 




No. of Layer

Up to 40 layers


FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg

RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers

CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base

Min. Width/Spacing


Copper Thickness

1/3~12oz (12~420um)


0.1~6.0mm (0.004’’~0.240’’)

Min. Hole Spacing

PTH (Plated Through Hole)

0.10mm (0.004’’)

NPTH (Non Plated Through Hole)

0.10mm (0.004’’)

Surface Finish

HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver

Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.

Special Processing Board

Copper plate edge, Sink hole, Tear ink, FPC

14 layer bule soldermask 300*265mm ENIG multilayer customized PCB board:

BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT solder paste to the circuit board is connected. Their differences are listed in the surrounding "space was the" single-row pin, such as gull wing room to move, room to move flat or retracted abdomen and foot end of the J-; changed to the bottom belly full array or an array of local, the adoption of a two dimensional area of the solder ball pinout, as the chip package on the circuit board solder interconnection tools. It has an area of less packaging, increased functionality, increased pin count, high reliability, good electrical properties, low overall cost.




The outer line of the BGA production:

BGA can refer to specifications, design pad size corresponding to the position of a customer to make a standard design BGA BGA array, and then as its benchmarks to be corrected under the BGA and BGA vias were being shot, to be filmed after the original is not shoot before the backup check the level of contrast before and after being shot effect, if BGA pad around large deviations, can not only beat BGA position over the next hole.





Model Number:XCEPCB009   

Shipping port:ShenZhen/HongKong          

Place of origin:GuangDong,China    

Delivery Time:3-10 Working Days  

Production capacity:FR4:2000000Sqms   High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union




Molde Number:xcepcb009



Panel Size:75*65mm

Board Thickness:1.0mm

Package Details:


     Bubble bag

     With Foam

Outer:Carton Box

Min Line Space:4Mil

Min Line Width:4Mil

Min Hole Size:10Mil

Finished Surface:ENIG

Special requirement:


Resin hole

Provide Slice report

Finished Copper:1oz

Delivery Time8 Days


Shenzhen Xinchenger Electronics was a leading manufacturer of high frequency and high difficult pcb circuit board for many years in shenzhen.We have newest pcb machine like laser drill machine,can do min2mil line space and width for you.


With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.

Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English.

Gold Fingers

1 to 4 edges

Solder Mask Type

Per IPC-SM-840
LPI Soldermask
Peelable Soldermask

Solder Mask Colors

Matte White
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix

Silkscreen Type

Thermal Cure Epoxy Ink

Silkscreen Colors

Yellow Top and Bottom Mix
Red One or Both Sides Mix

CNC Functions

Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250” Spacing Milling
30 or 60 Degree Score Angle Blind and

Buried Vias

30 to 100 Degree Countersink Controlled 

Z Axis Route

15 to 45 Degree Gold Finger Bevel 

Castellated Barrels

Counterbores Offset or Recessed Beveling
Plated Countersinks

Other PCB Services

Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps 

(Solder Mask)
Conductive Filled Vias

Quality / Testing

Inspect to IPC Class III Continuity Resistance

 – 10 to 20 Ohms
Net List Test per IPC-356D Isolation 


 – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum

SMT Pitch 0.5 mm


PTH Hole Size – +/- .002”
Front to Back – +/- .002”
NPTH Hole Size – +/- .001”
Solder Mask – +/- .002”
Tooling Holes – +/- .001”
Hole to Pad – +/- .005”


Competitive Advantage:
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.



Contact Information:

Karen-Sales Department

ShenZhen Xinchenger Electronic Co.,Ltd






Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you 14 layer bule soldermask 300265mm enig multilayer customized pcb board with competitive price. Just be free to buy good 14 layer bule soldermask 300265mm enig multilayer customized pcb board at reasonable price with us and get the datasheet from our suppliers who can working for you.

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