BGA 10 layer multilayer printed circuit board with immerison gold finished surface Q:Are you Factory or Trade company? A:We are factory manufacturer,welcome to visit our factory. Q:What kind of PCB file format can you accept for production? A:Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB Q:Can you...
BGA 10 layer multilayer printed circuit board with immerison gold finished surface
Q:Are you Factory or Trade company?
A:We are factory manufacturer,welcome to visit our factory.
Q:What kind of PCB file format can you accept for production?
A:Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB
Q:Can you accept copy board?
A:Yes,if you have pcb sample,can send to us,not only for PCB board,but also for PCBA,we can accept copy board
Q:How about your factory production capacity?
A:FR4:2000000Sqms High Frequency board:10000Sqms
The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)
Yellow and white core plate divided core material, usually white core material;
Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";
Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;
Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;
TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)
CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);
Dielectric constant (Er): general value 4.2-4.5;
Thermal decomposition temperature (TD): typ. 305 ℃;
1. Full name: epoxy fiberglass cloth prepreg, the English name: PrePreg;
2,.the role: between insulating layers and plays the role of an adhesive (plywood will be used);
3.size and thickness: a, common: 1080 (3.0mil ± 0.3), 2116 (4.5mil ± 0.5), 7628 (7.3mil ± 0.7); b, is not commonly used: 106,3313,1080L, 1080M, 1080H, 2116L , 2116M, 2116H, 1506,7628L, 7628M, 7628H, 7630;
4.only the general nip between the structural layer and a layer of PP, if exceeded, the need to improve the unit price quote;
The full name of Ball BGA Grid Array (BGA package), which is produced at the bottom of the ball array package substrate as the circuit I / O terminals and the printed circuit board (PCB) interconnected. Devices using the technology package is a surface mount device.
BGA package (Ball Grid Array Package) of I / O terminals are round or columnar pad matrix form distributed in the following packaging advantages of BGA technology is the I / O pin count, although increased, but did not pitch Save small but increased, thereby improving the assembly yield; although it increases the power consumption, but can be controlled collapse chip BGA welding method, which can improve its electric properties; thickness and weight than prior art encapsulation decreased ; reduce parasitics, the signal propagation delay is small, the frequency of use greatly increased; coplanar welding assembly is available, and high reliability.
Company spirit:Customer first,openness basing on sincerity.
Comapny culture:Improve employees quality with on the job training.
Quality policy:Honesty,superior quality,high efficiency.
Company tenet: Provide customers with satisfactory products and service is our eternal tenet.
Place of origin:GuangDong,China
Delivery Time:3-10 Working Days
Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms
Minimum Order Quantity:1pc
Payment terms:TT,Paypal,Western Union
Min Line Space:4Mil
Min Line Width:4Mil
Min Hole Size:10Mil
Provide Slice report
Delivery Time：8 Days
FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.
1 to 24 layers
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
0.20mm to 3.4mm
0.5 OZ to 4 OZ
Copper thickness in hole:
>25.0 um (>1mil)
Max. Board Size:
Min. Drilled Hole Size:
Min. Line Width:
Min. Line Spacing:
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
No. of Layer
Up to 40 layers
FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg
RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers
CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base
Min. Hole Spacing
PTH (Plated Through Hole)
NPTH (Non Plated Through Hole)
HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver
Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.
Special Processing Board
Copper plate edge, Sink hole, Tear ink, FPC
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
ShenZhen Xinchenger Electronic Co.,Ltd