10-Layer PCB with Hot-Air Solder Leveling Finish

Product Details

Key Specifications/Special Features:

• Multilayer PCBs

• Number of layers: Up to 12-layers

• Major material: FR-4, CEM-3 (other materials upon request)

• Min. board thickness:

• Double side: 0.2mm (7.8 mil)

• 4 layer: 0.6mm (24 mil)

• 6 layer: 0.8mm (32 mil)

• 8 layer: 1.0mm (40 mil)

• 10 layer: 1.2mm (48 mil)

• 12 layer: 1.5mm (59 mil)

• Max. board thickness: 2.4mm (95 mil)

• Surface finishing:

• Flash gold plating

• Immersion gold (max. 0.5 micrometer)

• Thick gold plating (max. 1.0 micrometer)

• Hot-air solder leveling

• Entek coating (OSP)

• Solder mask: LPI (wet film), thermal cured type

• Other print:

• Carbon print, peelable solder mask

• Solder mask plugged hole

• Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140micrometer)

• Min. hole size: 0.3mm (12 mil)

• Hold size tolerance (NPTH): +/- 0.076mm (3 mil)

• Min. line width and spacing: 0.1mm (4 mil)

• Min. solder mask clearance: 0.076mm (3 mil)

• Min. annular ring: 0.076mm (3 mil)

• Profile and v-cut:

• V-cut, jump v-cut, CNC v-cut

• CNC-routing, stamping and beveling

• Special process: Blind/buried via hole

Main Export Markets:

• Asia

• Central/South America

Testing Procedures For PCB Board:

We perform multiple quality assuring procedures before shipping out any PCB board. 

These include:

* Visual Inspection

* Flying probe

* Impedance control

* Solder-ability detection

* Digital metallograghic microscope

* AOI (Automated Optical Inspection)

Quotation Requirement :

 Following specifications are needed for quotation:

  a) Base material

  b) Board thickness

  c) Copper thickness

  d) Surface treatment

  e) color of solder mask and silkscreen

   f) Quantity