Product Details Key Specifications/Special Features: Multilayer PCBs Number of layers: Up to 12-layers Major material: FR-4, CEM-3 (other materials upon request) Min. board thickness: Double side: 0.2mm (7.8 mil) 4 layer: 0.6mm (24 mil) 6 layer: 0.8mm (32 mil) 8 layer: 1.0mm (40 mil) 10 layer:...
Multilayer PCBs
Number of layers: Up to 12-layers
Major material: FR-4, CEM-3 (other materials upon request)
Min. board thickness:
Double side: 0.2mm (7.8 mil)
4 layer: 0.6mm (24 mil)
6 layer: 0.8mm (32 mil)
8 layer: 1.0mm (40 mil)
10 layer: 1.2mm (48 mil)
12 layer: 1.5mm (59 mil)
Max. board thickness: 2.4mm (95 mil)
Surface finishing:
Flash gold plating
Immersion gold (max. 0.5 micrometer)
Thick gold plating (max. 1.0 micrometer)
Hot-air solder leveling
Entek coating (OSP)
Solder mask: LPI (wet film), thermal cured type
Other print:
Carbon print, peelable solder mask
Solder mask plugged hole
Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140micrometer)
Min. hole size: 0.3mm (12 mil)
Hold size tolerance (NPTH): +/- 0.076mm (3 mil)
Min. line width and spacing: 0.1mm (4 mil)
Min. solder mask clearance: 0.076mm (3 mil)
Min. annular ring: 0.076mm (3 mil)
Profile and v-cut:
V-cut, jump v-cut, CNC v-cut
CNC-routing, stamping and beveling
Special process: Blind/buried via hole
Asia
Central/South America
Testing Procedures For PCB Board:
We perform multiple quality assuring procedures before shipping out any PCB board.
These include:
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)
Quotation Requirement :
Following specifications are needed for quotation:
a) Base material
b) Board thickness
c) Copper thickness
d) Surface treatment
e) color of solder mask and silkscreen
f) Quantity