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10-Layer PCB with Hot-Air Solder Leveling Finish

10-Layer PCB with Hot-Air Solder Leveling Finish

Product Details Key Specifications/Special Features: Multilayer PCBs Number of layers: Up to 12-layers Major material: FR-4, CEM-3 (other materials upon request) Min. board thickness: Double side: 0.2mm (7.8 mil) 4 layer: 0.6mm (24 mil) 6 layer: 0.8mm (32 mil) 8 layer: 1.0mm (40 mil) 10 layer:...

Product Details

                                 

Product Details

Key Specifications/Special Features:

  • Multilayer PCBs

  • Number of layers: Up to 12-layers

  • Major material: FR-4, CEM-3 (other materials upon request)

  • Min. board thickness:

    • Double side: 0.2mm (7.8 mil)

    • 4 layer: 0.6mm (24 mil)

    • 6 layer: 0.8mm (32 mil)

    • 8 layer: 1.0mm (40 mil)

    • 10 layer: 1.2mm (48 mil)

    • 12 layer: 1.5mm (59 mil)

  • Max. board thickness: 2.4mm (95 mil)

  • Surface finishing:

    • Flash gold plating

    • Immersion gold (max. 0.5 micrometer)

    • Thick gold plating (max. 1.0 micrometer)

    • Hot-air solder leveling

    • Entek coating (OSP)

  • Solder mask: LPI (wet film), thermal cured type

  • Other print:

    • Carbon print, peelable solder mask

    • Solder mask plugged hole

  • Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140micrometer)

  • Min. hole size: 0.3mm (12 mil)

  • Hold size tolerance (NPTH): +/- 0.076mm (3 mil)

  • Min. line width and spacing: 0.1mm (4 mil)

  • Min. solder mask clearance: 0.076mm (3 mil)

  • Min. annular ring: 0.076mm (3 mil)

  • Profile and v-cut:

    • V-cut, jump v-cut, CNC v-cut

    • CNC-routing, stamping and beveling

  • Special process: Blind/buried via hole




Main Export Markets:

  • Asia

  • Central/South America



Testing Procedures For PCB Board:

 

We perform multiple quality assuring procedures before shipping out any PCB board. 

These include:

 

* Visual Inspection

 

* Flying probe

 

* Impedance control

 

* Solder-ability detection

 

* Digital metallograghic microscope

 

* AOI (Automated Optical Inspection)

 

 

Quotation Requirement :

 

 Following specifications are needed for quotation:

 

  a) Base material

 

  b) Board thickness

 

  c) Copper thickness

 

  d) Surface treatment

 

  e) color of solder mask and silkscreen

 

   f) Quantity





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