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TEL: +86-755-26055813
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Email:sales3@xcepcb.com

Capability


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Capability

Standard

Advanced

Minimum Layer Count

1

1

Maximum Layer Count

12

40

Material

FR-4 (Tg-135C, 145C, 170C),  Halogen- free

Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003

Polyimide

Teflon

Black FR-4

Arlon AR-350

CEM-3

Getek Copper Clad Thermal Substrates

Hybrid (Rogers and FR4) BT Epoxy

Nelco 4013

PTFE

Metal Core Materials

Aluminum Core

Board Thickness

0.020"-0.125"

0.005"-0.250"

Maximum Board Size

16" x 22"

10" x 16"

12" x 21"

16" x 22"

22" x 28"

12" x 21"


22" x 28"

Copper Thickness

0.5 oz – 3 oz

0.25 oz – 12 oz

Minimum Trace Width / Spacing

0.004"/0.004"

0.003"/0.003"

Solder Mask Color

Green, Blue, Black, Red, Yellow, White, Clear, and customized

Silkscreen Color

White, Black, Yellow, Green, Red, Blue and customized 

Minimum Hole Size

0.008"

0.004"

Finished Hole Size Tolerance

+/-0.003"

+/-0.002"

PCB Surface Finish

HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG,  ENEPIG,

HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon

Ink, Hard Gold(Flash Gold), Soft Gold

IPC Class

Class 2

Class 3

Controlled Impedance Tolerance

+/-10 %

+/-5 %

Blind Vias

Yes

Yes

Buried Vias

Yes

Yes

Aspect Ratio

81

115

Minimum Core Thickness

0.004"

0.002"

Carbon Ink

Yes

Yes

Peelable Mask

Yes

Yes

Solder Sample

Yes

Yes

First Article

Yes

Yes

ISO 9001: 2008

Yes

Yes

ISO/TS16949: 2009

Yes

Yes

UL 94v0

Yes

Yes


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